Zobrazeno 1 - 10
of 73
pro vyhledávání: '"Hisashi TANIE"'
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 86, Iss 883, Pp 19-00330-19-00330 (2020)
Various bonding materials have been developed for power semiconductor products. However, the fatigue characteristics of many of these materials are difficult to evaluate uniformly using a conventional test, and this difficulty represents an obstacle
Externí odkaz:
https://doaj.org/article/7c46568ce2e6458b8f9fc65d6c0908b5
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 831, Pp 15-00446-15-00446 (2015)
The purpose of this study is to investigate the dominant factor on the fracture strength of thin film comprising of copper (Cu) helical nano-elements, which are grown by the glancing angle deposition technique. By changing the deposition angle in the
Externí odkaz:
https://doaj.org/article/5ffb89839721426a9069d0576cc55564
Publikováno v:
Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 824, Pp 15-00018-15-00018 (2015)
A Kriging-based method for efficiently searching materials was used to select additive elements in lead-free solders that are effective for suppressing the grain-boundary diffusion, which is the cause of smaller breaking elongation than lead-containe
Externí odkaz:
https://doaj.org/article/8d860fdaa4944a5db8a8df75911bf57a
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 22:112-118
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6d824cd77105bc8ed4694e82cb526146
https://doi.org/10.5104/jiep.22.112
https://doi.org/10.5104/jiep.22.112
Publikováno v:
Journal of Smart Processing. 5:251-258
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::037f93a15c9027b770a34cfb574bd065
https://doi.org/10.7791/jspmee.5.251
https://doi.org/10.7791/jspmee.5.251
Publikováno v:
The Proceedings of the Materials and Mechanics Conference. 2015:GS0503-39
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b02f01a6b3af35b4078183c98c2b3db4
https://doi.org/10.1299/jsmemm.2015._gs0503-39
https://doi.org/10.1299/jsmemm.2015._gs0503-39
Publikováno v:
Transactions of the JSME (in Japanese). 81:15-00018
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::67aa1e5c06819ff4833bd48ca2e609b0
https://doi.org/10.1299/transjsme.15-00018
https://doi.org/10.1299/transjsme.15-00018
Publikováno v:
Key Engineering Materials. 626:178-181
The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d6634dda2363dbd24405c74d6cde5e3
https://doi.org/10.4028/www.scientific.net/kem.626.178
https://doi.org/10.4028/www.scientific.net/kem.626.178
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 17:123-131
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb676553094d34ac9da2c48c2a564e7a
https://doi.org/10.5104/jiep.17.123
https://doi.org/10.5104/jiep.17.123
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 5:1-11
We have developed a modified accumulated damage model that can be used to predict fatigue failure lives of solder joints in electronic devices. Our model calculates the fatigue failure life of solder on the basis of the damage that accumulates during
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::25ed8c1bf3219d57045484ec08cf2b75
https://doi.org/10.5104/jiepeng.5.1
https://doi.org/10.5104/jiepeng.5.1