Zobrazeno 1 - 10 of 11 pro vyhledávání: '"Hisashi Nakamoto"'
1
Resetting scheme for plastic strain range evaluation in cyclic plasticity: Experimental verification
Autor: Hisashi Nakamoto, Yusuke Morimatsu, Takeshi Hamada, Nobutada Ohno, Dai Okumura
Publikováno v: International Journal of Plasticity. 123:56-69
It has been proposed that a plastic strain surface is reset to a point and re-evolves every cycle to correctly evaluate the plastic strain range under cyclic loading (Ohno et al., 2018b). This resetting scheme has the advantage of providing a definit
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::7a3c667d7f2a39a0fbd671e543d47221
https://doi.org/10.1016/j.ijplas.2019.07.008
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3
Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation
Autor: Aki Miyagaki, Hisashi Nakamoto, Tetsuya Yoshikawa, Masao Mizuno, Onishi Takashi, Jun Munemasa, Takao Inoue
Publikováno v: Journal of Electronic Materials. 39:2255-2266
The behavior of void growth in ultra-large-scale integration Cu interconnections has been investigated by grain-boundary diffusion simulation to confirm the effectiveness of the high-pressure reflow process for suppressing stress-induced voiding. Voi
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::6e861c2b409d4a9c14703324a1ce0faa
https://doi.org/10.1007/s11664-010-1311-4
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4
Reflow Phenomenon Analysis of Large Scale Integrated Cu Interconnections in Via Holes by Viscoelastic Deformation Simulation
Autor: Tetsuya Yoshikawa, Masao Mizuno, Hisashi Nakamoto, Onishi Takashi, Takao Inoue, Takayuki Onoda, Jun Munemasa, Aki Miyagaki
Publikováno v: Journal of Electronic Materials. 39:318-325
The reflow phenomenon of Cu interconnections deposited over via holes was analyzed by viscoelastic deformation simulation using a finite-element method to clarify the embedding mechanism of Cu interconnections into via holes in a novel dual-damascene
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1c09bbb8f6fcf01504463600ed5d9f0b
https://doi.org/10.1007/s11664-010-1081-z
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5
Effect of Material Inhomogeneity on Fracture Toughness(Effect of Temperature-gradient)
Autor: Hiroomi Homma, Hisashi Nakamoto, Yasuhiro Kanto
Publikováno v: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 71:428-434
The numerical analysis was performed to estimate the effect of material inhomogeneity induced by a temperature gradient on fracture toughness for SM 490 A steel. The temperature gradient in the specimen creates change in plastic properties at a posit
Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::f536ea224396eaf368102fc2979ce1d1
https://doi.org/10.1299/kikaia.71.428
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