Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Hiroyuki Fukai"'
Publikováno v:
International Journal of Materials Research. 100:1255-1259
X-ray photoelectron spectroscopy (XPS), electron microprobe microanalysis (EPMA), and secondary ion mass spectrometry (SIMS) have been used for analyzing the chemical composition in surface layers of iron-base alloys. Samples analyzed in this study w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::79ece5f6f31f40979071f3101f77d400
https://doi.org/10.3139/146.110185
https://doi.org/10.3139/146.110185
Autor:
Maruyama Tadakatsu, Shigeru Suzuki, Hiroshi Kubo, Yoshio Waseda, Hiroyuki Fukai, Shuji Hanada, Naoya Masahashi
Publikováno v:
MATERIALS TRANSACTIONS. 46:1745-1748
Electron microprobe microanalysis (EPMA), secondary ion mass spectrometry (SIMS) and X-ray photoelectron spectroscopy (XPS) were used for charactering the surface composition of an Fe–Mn–Si–Cr shape memory alloy. The effect of annealing under v
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0a6353542302d237d8d113bc0e90a8e
https://doi.org/10.2320/matertrans.46.1745
https://doi.org/10.2320/matertrans.46.1745
Autor:
Tadao Ishikawa, Hiroyuki Fukai, Takashi Ichinose, Jun Motohashi, Chikashi Nakazawa, Isao Chihara
Publikováno v:
IEEJ Transactions on Power and Energy. 119:6-13
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6879145d288ba9e4ef3ded0438026583
https://doi.org/10.1541/ieejpes1990.119.1_6
https://doi.org/10.1541/ieejpes1990.119.1_6
Publikováno v:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits. 11:338-342
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd83f28740c4017ceb443f56c8f3f8cd
https://doi.org/10.5104/jiep1995.11.338
https://doi.org/10.5104/jiep1995.11.338
Autor:
Hikari Murai, Makoto Kato, Hiroyuki Fukai, Youichi Kaneko, Fujimoto Daisuke, Yamada Kunpei, Nobuyuki Ogawa
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
As electronic parts increase its performance and miniaturize in its size, package substrates are demanded to be thinner and higher in density. But higher density substrates using insulating films give higher warpage values when they are very thin, du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e64840f2d7880040665539ee32328dc
https://doi.org/10.1109/ectc.2011.5898542
https://doi.org/10.1109/ectc.2011.5898542
Publikováno v:
Conference Record of the 1988 IEEE Industry Applications Society Annual Meeting.
When a grounded metal sphere (⊘ 16 mm) approaches a charged polyethylene terephthalate sheet (75–850 μm thick) backed by a grounded metal layer, discharges occur between the sphere and the surface, and they spread on the surface. The discharges
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bfd3ec9f369efecfca735c4d73bdbeee
https://doi.org/10.1109/ias.1988.25270
https://doi.org/10.1109/ias.1988.25270
Publikováno v:
Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154).
The sequential build-up process with photo-sensitive dielectric is a most significant candidate for achieving high density multilayer wiring substrates for low cost multichip modules. A high performance dielectric material is essential in order to ob
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f42a7981555ec96b4d0986f59f798f9c
https://doi.org/10.1109/icmcm.1998.670782
https://doi.org/10.1109/icmcm.1998.670782
Publikováno v:
2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225).
The photo-via build-up process is a most significant candidate for fabrication of high density multi-layer wiring boards for high density packaging using CSP and flip-chip direct attach. We have developed a new type of photo-sensitive dielectric. The
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::128c9287d23d0b7708ea41366d84b99f
https://doi.org/10.1109/iemtim.1998.704522
https://doi.org/10.1109/iemtim.1998.704522
Conference
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Conference
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