Zobrazeno 1 - 10
of 16
pro vyhledávání: '"Hirotoshi Aoki"'
Autor:
Zheng-Feng Li, Nobuya Nishida, Hirotoshi Aoki, Hisashi Shibata, Chih-Chia Liao, Ming-Shi Huang
Publikováno v:
IEEE Access, Vol 10, Pp 10079-10093 (2022)
In this study, cosimulation with Q3D and Simplorer were adopted to design a single-phase power stack with equal output current on three paralleled IGBT modules in high power application, therefore, the derating of total current will be reduced, which
Externí odkaz:
https://doaj.org/article/2b599a2d6e8f431cbe0c9163470c6f04
Publikováno v:
Journal of The Japan Institute of Electronics Packaging. 26:117-124
Autor:
Zheng-Feng Li, Nobuya Nishida, Hirotoshi Aoki, Hisashi Shibata, Chih-Hung Ma, Hsiang-Ming Liu, Ming-Shi Huang
Publikováno v:
2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia).
Autor:
Takayuki Yamabe, Yoshinori Aruga, Masaru Ishizuka, Koichi Hirasawa, Hirotoshi Aoki, Tomoyuki Hatakeyama, Shinji Nakagawa
Publikováno v:
2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC).
In this paper, a method of estimating the temperature of densely mounted chip components was discussed. The temperature distribution and heat flow inside the pad under various pad conditions was investigated by numerical experiments using simulation.
Autor:
Takayuki Yamabe, Masaru Ishizuka, Koichi Hirasawa, Tomoyuki Hatakeyama, Hirotoshi Aoki, Yoshinori Aruga, Shinji Nakagawa
Publikováno v:
2017 IEEE CPMT Symposium Japan (ICSJ).
In this paper, The relationship between the temperature rise of the heat generating components densely mounted in a grid pattern on the board and the various board design conditions was discussed. Based on the discussion, a simple estimation formula
Autor:
Koichi Hirasawa, Masaru Ishizuka, Hirotoshi Aoki, Tomoyuki Hatakeyama, Shinji Nakagawa, Yoshinori Aruga
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
In this paper, temperature estimation method of heat-generating components in dense mounting was discussed. Specifically, simulation of components arranged densely in a grid pattern on a PCB was carried out. The relationship between temperature rise
Publikováno v:
The Proceedings of the Thermal Engineering Conference. 2019:0054
Autor:
Masaru Ishizuka, Yoshinori Aruga, Shinji Nakagawa, Hirotoshi Aoki, Koichi Hirasawa, Tomoyuki Hatakeyama
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
In recent years, thermal management of electronic components is getting all the more important with the advance in downsizing and higher density packaging of electronics. The authors have proposed a concept of thermal network modeling to be used in e
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP).
Recently, measurement of surface temperature with thermocouples has become difficult because of the advanced downsizing of electronic components.
Autor:
Tomoyuki Hatakeyama, Takayuki Yamabe, Hirotoshi Aoki, Shinji Nakagawa, Masaru Ishizuka, Yoshinori Aruga, Koichi Hirasawa
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 11:E18-005