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pro vyhledávání: '"Hirotaka Oomori"'
Autor:
Hirotaka Oomori, Ichiro Omura
Publikováno v:
Power Electronic Devices and Components, Vol 6, Iss , Pp 100043- (2023)
Designing switching waveforms is a technique for mitigating a trade-off between loss and noise in switching power devices. A novel and simple method has been proposed to compute the gate waveform to realize a designed switching waveform. The gate cur
Externí odkaz:
https://doaj.org/article/73a2cbc421934739bd7e3ef03c4f258d
Autor:
Hirotaka Oomori, Ichiro Omura
Publikováno v:
Power Electronic Devices and Components, Vol 3, Iss , Pp 100018- (2022)
The switching waveform design, especially controlling and optimizing the slew rate, is an efficient technique to mitigate the trade-off between decreasing the loss and increasing the noise of the switching power device. The digital active gate driver
Externí odkaz:
https://doaj.org/article/bf258b3da12546da957d36b6f9412d9c
Publikováno v:
2022 IEEE 34th International Symposium on Power Semiconductor Devices and ICs (ISPSD). :189-192
There is a trade-off between surge voltage and switching loss in power semiconductors, and it has been difficult to reduce both. In order to solve this problem, the digital gate drive method has been studied. However, the digital gate drive method ha
Autor:
Hirotaka Oomori, Toru Hiyoshi, Hiroshi Egusa, Takashi Tsuno, Yu Saito, Kosuke Uchida, Tatsushi Kaneda
Publikováno v:
Materials Science Forum. 1004:776-782
1200 V / 200 A V-groove trench MOSFET optimized to achieve low power loss, high oxide reliability under a drain bias condition and high avalanche ruggedness is shown in this paper. We revealed a relationship between the lifetime under a high temperat
Autor:
Mitsuaki Nishie, Moriyasu Ichino, Atsushi Miki, Ichiro Tonai, Masayuki Shigematsu, Toshio Mizue, Hirotaka Oomori
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:1147-1153
The world's smallest distributed-feedback laser modules using the miniature thermoelectric cooler (TEC) has been developed. By the virtue of reducing the heat load of the built-in TEC, the module has been successfully downsized to $\phi 5.6\times 12.
Conference
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