Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Hiroshi Simizu"'
Publikováno v:
Analytical Sciences. 16:593-596
A computer program was developed for the identification and quantification of organic contaminants on silicon wafer surfaces and related materials based on GC/MS spectral data. Information, such as the retention time (RT), mass number and peak intens
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e185ebfbc4d467a2b6e52cb30d1f004d
https://doi.org/10.2116/analsci.16.593
https://doi.org/10.2116/analsci.16.593
Autor:
Tetsuro Iwakura, Fujimoto Daisuke, Hikari Murai, Yamada Kumpei, Youichi Kaneko, Hiroshi Simizu
Publikováno v:
2013 3rd IEEE CPMT Symposium Japan.
As electronic parts increase its performance and miniaturize the size, package substrates are demanded to be thinner as well as higher in density. Thin packages such as Chip Scale Package (CSP) require high elastic modulus and low coefficient of ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c6746a03d3dc8ad5b7d814d57de0899
https://doi.org/10.1109/icsj.2013.6756078
https://doi.org/10.1109/icsj.2013.6756078
Autor:
Hiroshi Simizu
Publikováno v:
Journal of the Society of Mechanical Engineers. 108:450-451
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0e799e2fdb041d548b218afa885c99db
https://doi.org/10.1299/jsmemag.108.1039_450
https://doi.org/10.1299/jsmemag.108.1039_450