Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hiroshi Nishinakayama"'
Publikováno v:
Electrochemistry. 74:479-483
The purpose of this investigation was to study electroless Au plating from a sulfite/thiosulfate complex bath (0.015M Na3[Au(SO3)2]+0.1M Na2S2O3+0.4M Na2SO3+0.05M C6H7O6Na+0.18M KOOCCH(OH)CH(OH)COONa) using erythorbic acid as the reducing agent. Depo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01829e43f1723245830c92fd40bac897
https://doi.org/10.5796/electrochemistry.74.479
https://doi.org/10.5796/electrochemistry.74.479
Publikováno v:
Journal of The Surface Finishing Society of Japan. 56:463-467
Electroless nickel plating has been extensively applied on copper circuits as an under-layer deposition for solder joints, since it is possible to deposit on the isolated patterns without an outer electrode. A palladium catalyst is generally used for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::676e2ede023195702ca53af62ee69219
https://doi.org/10.4139/sfj.56.463
https://doi.org/10.4139/sfj.56.463
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 7:261-265
Copper filling of the vias for the construction of build-up multilayer has been realized to produce the high-density interconnection. Via filling is already achieved by the selection of additives such as Bis (3-sulfopropyl) disulfidedisodium (SPS) as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b25aa85bd2f552803346006b2c8a87ac
https://doi.org/10.5104/jiep.7.261
https://doi.org/10.5104/jiep.7.261
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 6:228-233
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::508b0d066378d69da63f6f015eb2c26a
https://doi.org/10.5104/jiep.6.228
https://doi.org/10.5104/jiep.6.228
Publikováno v:
Journal of The Surface Finishing Society of Japan. 54:539-541
System In Package (SIP) technologies have been extensively studied to realize high-density packaging and high operation performance. A key technology for 3D chip stacking as a shortest connection is required. We found that void free copper filling fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::933f802703bab390810c0e2f749ebafc
https://doi.org/10.4139/sfj.54.539
https://doi.org/10.4139/sfj.54.539