Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Hiroshi Mawatari"'
Autor:
Hiroshi Kudo, Takamasa Takano, Masaya Tanaka, Hiroshi Mawatari, Daisuke Kitayama, Takahiro Tai, Tsuyoshi Tsunoda, Satoru Kuramochi
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8623796743b4f809cab7043e57544a96
https://doi.org/10.1109/ectc51906.2022.00137
https://doi.org/10.1109/ectc51906.2022.00137
Autor:
Satoru Kuramochi, Takamasa Takano, Kousuke Suzuki, Yoshitaka Fukuoka, Sumio Koiwa, Miyuki Akazawa, Hiroshi Mawatari
Publikováno v:
International Symposium on Microelectronics. 2014:000376-000381
As electronic product becomes smaller and lighter with an increasing number of function ↚ the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electron
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7a246fc33d27f85f3f390810c886e09
https://doi.org/10.4071/isom-wa11
https://doi.org/10.4071/isom-wa11
Autor:
Satoru Kuramochi, Masaya Tanaka, Hiroshi Mawatari, Yoshitaka Fukuoka, Hiroshi Kudo, Miyuki Akazawa
Publikováno v:
2016 IEEE CPMT Symposium Japan (ICSJ).
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c706505ceb65ed7772a8d00c28a859f
https://doi.org/10.1109/icsj.2016.7801263
https://doi.org/10.1109/icsj.2016.7801263
Autor:
Miyuki Akazawa, Hiroshi Mawatari, Hiroshi Kudo, Yoshitaka Fukuoka, Masaya Tanaka, Satoru Kuramochi
Publikováno v:
2016 6th Electronic System-Integration Technology Conference (ESTC).
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b54852329650492a40b9ca7a160487e
https://doi.org/10.1109/estc.2016.7764697
https://doi.org/10.1109/estc.2016.7764697
Autor:
Daisuke Kitayama, Miyuki Akazawa, Hiroyuki Sato, Masaya Tanaka, Kouji Sakamoto, Hiroshi Mawatari, Yumi Okazaki, Ryohhei Kasai, Hiroshi Kudo, Shouhei Yamada, Toshio Sasao, Susumu Tashiro, Naoki Oota, Satoru Kuramochi, Haruo Iida, Takamasa Takano, Mitsuhiro Takeda, Jyunichi Suyama
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
An enhanced redistribution layer architecture has been developed in which the Cu wires are directly covered with a double layer consisting of two types of dielectrics by using a semi-additive process. The double layer enhanced the thermal and electri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c989cb81643fa8b51aa38b80758c324b
https://doi.org/10.1109/ectc.2016.69
https://doi.org/10.1109/ectc.2016.69
Autor:
Hiroshi Mawatari, Hiroyuki Nagano, Satoru Kuramochi, Yoshitaka Fukuoka, Sumio Koiwa, Kousuke Suzuki, Jiro Iida, Miyuki Akazawa
Publikováno v:
2016 Pan Pacific Microelectronics Symposium (Pan Pacific).
As electronic products becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a9a07cbcb73d9af25b67d218f6f296a
https://doi.org/10.1109/panpacific.2016.7428426
https://doi.org/10.1109/panpacific.2016.7428426
Publikováno v:
Journal of the Magnetics Society of Japan. 27:414-418
We designed high-frequency-carrier type thin film sensors to obtain high impedance change. We considered the relationships between carrier current density and noise level, carrier current density and sideband level, and optimum impedance of sensor el
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::000775bf06a82f85b3c14f54a41ebbeb
https://doi.org/10.3379/jmsjmag.27.414
https://doi.org/10.3379/jmsjmag.27.414
Autor:
Miyuki Akazawa, Toshihiro Itoh, K. Fujimoto, Kousuke Suzuki, Hiroshi Mawatari, Seiichi Yoshimi, Ryutaro Maeda, Hidenobu Matsumoto
Publikováno v:
2013 IEEE 63rd Electronic Components and Technology Conference.
A Silicon interposer with through silicon via (TSV) has become important key components of 3D integration. It is used as an intermediate carrier and a wiring device for IC components like logics, memories, sensors, and so on. Due to wiring with custo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c6b8b587d75706803196765478ee50a
https://doi.org/10.1109/ectc.2013.6575881
https://doi.org/10.1109/ectc.2013.6575881
Publikováno v:
Applied Surface Science. :558-562
Hydrogenated amorphous silicon (a-Si:H) films were deposited by a tetrode RF sputtering method and annealed at a low temperature of 200°C in high vacuum for 120 min. Metal/a-Si:H interfaces were formed by vacuum deposition on the surfaces of anneale
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a1afcad442f889748765ba7e1981eb85
https://doi.org/10.1016/0169-4332(92)90288-9
https://doi.org/10.1016/0169-4332(92)90288-9
Publikováno v:
Progress of Theoretical Physics. 50:1981-1999
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::87518b12f3d70bbe1dad37fe1e6b0969
https://doi.org/10.1143/ptp.50.1981
https://doi.org/10.1143/ptp.50.1981