Zobrazeno 1 - 10
of 104
pro vyhledávání: '"Hiroshi Ishino"'
Autor:
Zheng Zhang, Chuantong Chen, Aiji Suetake, Hiroshi Ishino, Hirokazu Sampei, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma
Publikováno v:
IEEE Transactions on Power Electronics. 38:1468-1478
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f49201148624464da2427e9f96b83ce
https://doi.org/10.1109/tpel.2022.3209740
https://doi.org/10.1109/tpel.2022.3209740
Autor:
Zheng Zhang, Aiji Suetake, Chuantong Chen, Osamu Katayama, Hiroshi Ishino, Takeshi Endo, Kazuhiko Sugiura, Kazuhiro Tsuruta, Katsuaki Suganuma
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::35af2726fd3b911dc7fb821bdff4ab08
https://doi.org/10.23919/icep55381.2022.9795523
https://doi.org/10.23919/icep55381.2022.9795523
Autor:
Hirokazu Sampei, Kazuhiko Sugiura, Zheng Zhang, Chuantong Chen, Katsuaki Suganuma, Takeshi Endo, Hiroshi Ishino, Aiji Suetake, Kazuhiro Tsuruta
Publikováno v:
2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD).
In this work, we applied a acoustic emission monitoring (AEM) technique to inspect solder deterioration in a clip-bonding SiC MOSFET power module during power cycling test (PCT). Solder deterioration was confirmed by SAT image and successfully monito
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4945e809404e86bb1645956a3495056d
https://doi.org/10.23919/ispsd50666.2021.9452263
https://doi.org/10.23919/ispsd50666.2021.9452263
Autor:
Kazuhiro Tsuruta, Katsuaki Suganuma, S. W. Park, Kazuhiko Sugiura, Y. Kato, Shijo Nagao, Hiroshi Ishino
Publikováno v:
Journal of Alloys and Compounds. 637:143-148
A novel die-attachment method is demonstrated through quasi-transient liquid-phase bonding using Sn-plated Zn sheets. The bonding temperature can be decreased to 250 °C, which is ∼100 °C lower than that for typical Zn–Sn high-temperature solder
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f6fc831cc0e225d4c24f7de9cb374a94
https://doi.org/10.1016/j.jallcom.2015.02.223
https://doi.org/10.1016/j.jallcom.2015.02.223
Autor:
Hiroshi Ishino, Kazuhiro Tsuruta, Shijo Nagao, Yoshitaka Kato, S. W. Park, Kazuhiko Sugiura, Katsuaki Suganuma
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 5:902-909
Pure Zn is a Pb-free die-attach material considered suitable for application in high-temperature electronics such as widebandgap semiconductor devices, as it has both the requisite electrical/thermal conductivity and an excellent thermal shock resist
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::91c53a3e5bd769c0527ed92a4512fece
https://doi.org/10.1109/tcpmt.2015.2443058
https://doi.org/10.1109/tcpmt.2015.2443058
Autor:
Atsushi Ishino, Hisashi Hosaka, Yuko Date, Syun Sato, Yukihiro Wada, Kazuma Mori, Toshiaki Kunimura, Toshio Morohoshi, Takeyoshi Kitayama, Kenji Iwaku, Hiroshi Ishino, Kyoko Matsukawa
Publikováno v:
The Showa University Journal of Medical Sciences. 17:177-184
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4a48163d94fd2b69e552667bcd31afd2
https://doi.org/10.15369/sujms1989.17.177
https://doi.org/10.15369/sujms1989.17.177
Autor:
Atsushi Ishino, Nobuyuki Ohike, Yuko Date, Kenji Iwaku, Kyoko Matsukawa, Hiroshi Ishino, Toshio Morohoshi, Kazuo Nagoshi, Masanobu Iri
Publikováno v:
The Showa University Journal of Medical Sciences. 17:137-144
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ea8a9fab5cbeae09cf4508cb7b0efc2
https://doi.org/10.15369/sujms1989.17.137
https://doi.org/10.15369/sujms1989.17.137
Publikováno v:
The Proceedings of the National Symposium on Power and Energy Systems. :421-424
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cbbddc6dd44d784b97a87deea80d0349
https://doi.org/10.1299/jsmepes.2004.9.421
https://doi.org/10.1299/jsmepes.2004.9.421
Autor:
Guo-Ping Zhang, Zhong Wang, Ruizhe Qian, Toshio Morohoshi, Hiroshi Ishino, Luchun Hua, Masao Mori, Hui-Ming Jin, Fengdi Zhao, Toshiaki Kunimura, Hisashi Hosaka, Masanobu Iri, Hironori Nakamura
Publikováno v:
The Showa University Journal of Medical Sciences. 16:231-236
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2597b8651f291f945b7d6ff55c5e5b8b
https://doi.org/10.15369/sujms1989.16.231
https://doi.org/10.15369/sujms1989.16.231
Autor:
Tomoko Inagaki, Kenji Iwaku, Kouji Saito, Kazuma Mori, Shigeru Yamamoto, Katsumi Asanuma, Ryouji Hayashi, Hiroshi Ishino, Masanao Nakashima, Jun Ushio, Qian Ruizhe, Hirotaka Kato, Toshiaki Kunimura, Makoto Nonaka, Daisuke Kataoka, Kasumi Sato, Toshio Morohoshi
Publikováno v:
The Showa University Journal of Medical Sciences. 15:331-336
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fb1bb7f9f30abe8ec74c94f64aca8d23
https://doi.org/10.15369/sujms1989.15.331
https://doi.org/10.15369/sujms1989.15.331