Zobrazeno 1 - 10
of 264
pro vyhledávání: '"Hiroshi Eda"'
Publikováno v:
Tribology Online, Vol 3, Iss 5, Pp 248-253 (2008)
This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this pa
Externí odkaz:
https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a
Autor:
Jun Shimizu, Haruki Otsuka, Yuya Sasamoto, Hirotaka Ojima, Yukihiro Murakami, Libo Zhou, Hiroshi Eda
Publikováno v:
Journal of the Japan Society for Precision Engineering. 75:773-777
The image processing technology has now been widely applied into many areas such as electronics, manufacturing and security. However, most of those applications are based on two dimensional images. Recently, there are increasing demands of 3D informa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4b54b57996bd45b890ab0a3a61974469
https://doi.org/10.2493/jjspe.75.773
https://doi.org/10.2493/jjspe.75.773
Publikováno v:
Key Engineering Materials. :417-423
TiO2 has some unique photocatalytic functions and some of them have been utilized industrially, and further functional enhancement and performance enhancement of TiO2 have been required. Under such circumstances, this study aims to clarify the influe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::98bd037b7df01d387ae22a298d4b16a9
https://doi.org/10.4028/www.scientific.net/kem.389-390.417
https://doi.org/10.4028/www.scientific.net/kem.389-390.417
Publikováno v:
Key Engineering Materials. :424-429
A method to easily and economically manufacture more precise patterns compared with usual MEMS technique has been searched for. Under such circumstances, this research aims to clarify the formation of nano-scale protrusion structure produced by local
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f75f6986c636990588b9ef84ecc4bcfe
https://doi.org/10.4028/www.scientific.net/kem.389-390.424
https://doi.org/10.4028/www.scientific.net/kem.389-390.424
Autor:
B.H. Soltani, Jun Shimizu, Libo Zhou, Hiroshi Eda, Takahito Mitsuta, Yoshiaki Tashiro, Yebing Tian, Sumio Kamiya, J. Sasaki, Hisao Iwase, Tatsuya Tsuruga
Publikováno v:
Key Engineering Materials. :13-17
Silicon wafer thinning process is meeting great challenges to fulfill requirements of ultra-thin IGBT for automotive applications. Chemo-mechanical grinding (CMG) process is potentially emerging stress relief thinning process which combines the advan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6ba8f5ded27fee64c34561ae63d1a6bf
https://doi.org/10.4028/www.scientific.net/kem.389-390.13
https://doi.org/10.4028/www.scientific.net/kem.389-390.13
Publikováno v:
Key Engineering Materials. :705-709
Currently, most of the diamond turning tools used for precision machining are still manually manufactured, the profile accuracy of the diamond cutting edge depends on the operator’s experience and skill, so that the process need to be automated. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f14ef00010aaf1788877fc2c64a4d58b
https://doi.org/10.4028/www.scientific.net/kem.375-376.705
https://doi.org/10.4028/www.scientific.net/kem.375-376.705
Publikováno v:
Journal of Thermal Spray Technology. 16:722-728
Three-dimensional molecular dynamics simulation was conducted to clarify at an atomic level the flattening process of a high-temperature droplet impacting a substrate at high speed. The droplet and the substrate were assumed to consist of pure alumin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8acb3cd73c56906a6bb3a0c13607d3e
https://doi.org/10.1007/s11666-007-9103-y
https://doi.org/10.1007/s11666-007-9103-y
Publikováno v:
Key Engineering Materials. 329:367-372
The single crystal of Si is still one of the most important candidates among other materials including Single crystals of SiC, GaN, C(diamond) or compound semiconductors. The innovative process as called CMG(Chemo-Mechanical-Grinding) for Si wafer ha
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8d0868f9f7090903c8320e26e0845c00
https://doi.org/10.4028/www.scientific.net/kem.329.367
https://doi.org/10.4028/www.scientific.net/kem.329.367
Publikováno v:
Key Engineering Materials. 329:379-384
This study aims to clarify the interaction between Si wafer and individual diamond abrasives in grinding at nanometer level and to estimate the grinding conditions for minimizing the surface defect. This paper reports on the results obtained through
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b610ecb075b7bf5293d43197dbc2296
https://doi.org/10.4028/www.scientific.net/kem.329.379
https://doi.org/10.4028/www.scientific.net/kem.329.379
Publikováno v:
Key Engineering Materials. 329:373-378
In this paper, the surface and subsurface of silicon wafers ground by different wheels have been studied. In the conventional grinding with diamond wheels, it is shown from the top that the subsurface of wafer consists of amorphous Si, followed by a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a81634deb473994f3ebfcf6645ce86e4
https://doi.org/10.4028/www.scientific.net/kem.329.373
https://doi.org/10.4028/www.scientific.net/kem.329.373