Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Hiroki Shinkawata"'
Autor:
Yoshiki Yamamoto, Kazuhiko Segi, Shibun Tsuda, Hideki Makiyama, Takumi Hasegawa, Keiichi Maekawa, Hiroki Shinkawata, Tomohiro Yamashita
Publikováno v:
IEEE Journal of the Electron Devices Society, Vol 7, Pp 825-828 (2019)
This paper reports new findings about the plasma-induced damage on silicon on thin buried oxide (BOX) transistor. The plasma charge collected by source or drain causes Vth shift, which depends on BOX thickness. In addition, the observation was made t
Externí odkaz:
https://doaj.org/article/3b959f8b90d34fc6ad7bbb408fe5fe6f
Autor:
Hideki Makiyama, Hiroki Shinkawata, Takumi Hasegawa, Kazuhiko Segi, Tomohiro Yamashita, Yoshiki Yamamoto, Keiichi Maekawa, Shibun Tsuda
Publikováno v:
2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
This paper reports new findings about the plasma induced damage on silicon on thin BOX. The plasma charge collected by source or drain causes Vth shift, which depends on BOX thickness. In addition, the plasma charge collected by gate also has same ef
Autor:
Yoshiki Yamamoto, Shinji Tanaka, Hiroki Shinkawata, Yukiko Umemoto, Shiro Kamohara, Makoto Yabuuchi, Takumi Hasegawa, Kyoji Ito, Koji Nii, Yohei Sawada, Yoshihiro Shinozaki
Publikováno v:
2018 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT).
In 65-nm Silicon-on-Thin-Box (SOTB) technology, we demonstrate fully functional embedded 6T single-port (SP) SRAM and 8T dual-port (DP) SRAM for Smart Internet-of-Things (IoT) applications. By using back-bias (BB) control in the sleep mode, 13.72 nW/
Autor:
Hiroki Shinkawata, Shinobu Okanishi, Hideki Makiyama, Yasuo Yamaguchi, Keiichi Maekawa, Yoshiki Yamamoto, Takumi Hasegawa
Publikováno v:
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
This paper report that the time-dependent Vth shift of transistor with Silicon on thin BOX (SOTB) can happen under large back bias. It is caused by slow inversion at BOX/Substrate interface. We show the guideline to consider this phenomena for device
Autor:
Takumi Hasegawa, Makoto Yabuuchi, Shinji Tanaka, Kyoji Ito, Koji Nii, Hiroki Shinkawata, Shiro Kamohara, Yoshiki Yamamoto, Yohei Sawada, Yoshihiro Shinozaki
Publikováno v:
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S).
An embedded 2-read/write (2RW) dual-port (DP) SRAM using 65-nm Silicon-on-Thin-Box (SOTB) is demonstrated. 25.85 nW/Mbit ultra-low standby power is observed by applying back-bias (BB) control in the sleep mode, reduced to 1/1000 compared to the norma
Autor:
Yoshiki Yamamoto, Shiro Kamohara, Shinji Tanaka, Takumi Hasegawa, Hiroki Shinkawata, Makoto Yabuuchi, Yoshihiro Shinozaki, Koji Nii
Publikováno v:
2017 Symposium on VLSI Circuits.
A 65-nm Silicon-on-Thin-Box (SOTB) embedded SRAM is demonstrated. By using back-bias (BB) control in the sleep mode, 13.72 nW/Mbit ultra-low standby power is observed, which is reduced to 1/1000 compared to the normal standby mode. The measured read
Autor:
Hideki Makiyama, Yoshiki Yamamoto, Yasuo Yamaguchi, Hiroki Shinkawata, Shiro Kamohara, Takumi Hasegawa
Publikováno v:
ICICDT
Ultra low power performance is indispensable for Micro Controller Unit (MCU) used as wireless sensor and communication nodes which needs battery maintenance free and energy harvesting operation in the Internet of things (IoT) era. The Silicon on Thin
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 27:178-183
An addressable test structure array for detecting soft failures in interconnect vias was developed. Resistive elements exhibiting abnormally high resistance are detected, while suppressing the measurement time, using a doubly nesting array structure.
Autor:
Hiroki Shinkawata, Keiichi Maekawa, Tomohiro Yamashita, Yoshiki Yamamoto, Hideki Makiyama, Shiro Kamohara, Yasuo Yamaguchi, Kenichiro Sonoda, Shinobu Okanishi, Takumi Hasegawa
Publikováno v:
Japanese Journal of Applied Physics. 57:04FD19
Publikováno v:
Proceedings of the 2015 International Conference on Microelectronic Test Structures.
We introduce a new addressable test structure array using for mass production stage which is compacted doubly nesting array into Narrow Scribe Line which named as High sensitivity-Screening and Detection-decoder test structure in Scribe line (HSD-S).