Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hiroki Nezu"'
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 10:438-444
In semiconductor manufacturing processes, it is important that the SiO/sub 2/ isolation films around aluminum connection lines have flat surfaces in order to produce the multilayered connection lines used in high-density devices. In this paper, we an
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 10:131-136
It is important that aluminum films fill the grooves on silicon substrates if high-density devices are to be produced. In this paper, we calculate the changes in the free-surface profiles of deposited aluminum films in a high-temperature reflow proce
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 79:75-82
This paper reports on recent improvements in organic spin-on glass (SOG) planarization technology combined with etch-back process. A general rule has been established for SOG planarization mechanism that is suitable for every kind of wiring pattern d
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 62:3421-3425
It is important that SiO2 isolation film around aluminum connection lines has a flat surface in order to realize high-density devices. In this study, the transient change in liquid-SOG (spin-on-glass) film thickness distribution on a two-dimensional
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