Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Hiroki Nezu"'
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 10:438-444
In semiconductor manufacturing processes, it is important that the SiO/sub 2/ isolation films around aluminum connection lines have flat surfaces in order to produce the multilayered connection lines used in high-density devices. In this paper, we an
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. 10:131-136
It is important that aluminum films fill the grooves on silicon substrates if high-density devices are to be produced. In this paper, we calculate the changes in the free-surface profiles of deposited aluminum films in a high-temperature reflow proce
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 79:75-82
This paper reports on recent improvements in organic spin-on glass (SOG) planarization technology combined with etch-back process. A general rule has been established for SOG planarization mechanism that is suitable for every kind of wiring pattern d
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B. 62:3421-3425
It is important that SiO2 isolation film around aluminum connection lines has a flat surface in order to realize high-density devices. In this study, the transient change in liquid-SOG (spin-on-glass) film thickness distribution on a two-dimensional
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Publikováno v:
Electronics & Communications in Japan, Part 2: Electronics. Jan1996, Vol. 79 Issue 1, p75-82. 8p.
Autor:
Hirasawa, Shigeki, Saito, Yoko
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing; Nov97, Vol. 10 Issue 4, p438, 7p, 5 Black and White Photographs, 2 Diagrams, 11 Graphs
Autor:
Saito, Yoko, Hirasawa, Shigeki
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing; Feb97, Vol. 10 Issue 1, p131, 6p, 22 Black and White Photographs, 2 Charts, 2 Graphs
Autor:
Furusawa, T., Homma, Y.
Publikováno v:
1995 Symposium on VLSI Technology Digest of Technical Papers; 1995, p59-60, 2p