Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hirohito Kikukawa"'
Autor:
N. Kuroda, Miho Miura, Hirohito Kikukawa, Hiroyuki Yamauchi, Y. Agata, K. Egashira, T. Uchikoba, T. Kawasaki, K. Takahashi, M. Shirahama, S. Hashimoto, S. Honda, H. Sadakata, W. Abe, R. Nishihara
Publikováno v:
IEEE Journal of Solid-State Circuits. 40:1200-1207
This paper describes a standard CMOS process based on embedded DRAM macro with dual-port interleaved DRAM architecture (D/sup 2/RAM), which is suitable for the leading edge CMOS LSIs with both high-speed and large-scale memories on a chip. This macro
Autor:
M. Ishikawa, A. Shibayama, Shigeki Tomishima, M. Senoh, H. Tanizaki, Hideto Hidaka, M. Maruta, T. Inokuchi, T. Kawasaki, Tsukasa Ooishi, W. Abe, K. Takahashi, S. Sakamoto, Hirohito Kikukawa, H. Kato, Y. Fukushima, Takaharu Tsuji, M. Nirro, T. Uchikoba
Publikováno v:
IEEE Journal of Solid-State Circuits. 37:932-940
This paper describes the 32-Mb and the 64-Mb embedded DRAM core with high efficient redundancy, which is fabricated using 0.13-/spl mu/m triple-well 4-level Cu embedded DRAM technology. Core size of 18.9 mm/sup 2/ and cell efficiency of 51.3% for the
Autor:
W. Abe, H. Tanizaki, Hirohito Kikukawa, T. Kawasaki, Takaharu Tsuji, H. Kato, Tsukasa Ooishi, M. Ishikawa, K. Takahashi, M. Maruta, Hideto Hidaka, S. Sakamoto, Y. Fukushima, T. Inokuchi, T. Uchikoba, Shigeki Tomishima, A. Shibayama, M. Niiro, M. Senoh
Publikováno v:
IEEE Journal of Solid-State Circuits. 36:1728-1737
This paper describes a 32-Mb embedded DRAM macro fabricated using 0.13-/spl mu/m triple-well 4-level Cu embedded DRAM technology, which is suitable for portable equipment of MPEG applications. This macro can operate 230-MHz random column access even
Autor:
Takaharu Tsuji, H. Tanizaki, M. Ishikawa, Hideto Hidaka, M. Niiro, K. Takahashi, Akinori Shibayama, M. Senoh, T. Uchikoba, Shigeki Tomishima, Hirohito Kikukawa, T. Inokuchi, Y. Fukushima, H. Kato, S. Sakamoto, M. Maruta, T. Ooishi, W. Abe, T. Kawasaki
Publikováno v:
2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177).
Previous embedded DRAMs (eDRAMs) have the dual ports on the sense amplifier and wide I/O buses on memory arrays for high data rate in graphic controller chips. This causes decreased cell efficiency and increased power consumption in burst operation c
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