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pro vyhledávání: '"Hirohisa Hino"'
Autor:
Naomichi Ohashi, Andy Behr, Hirohisa Hino, Suzuki Yasuhiro, Atsushi Yamaguchi, Yasuo Fukuhara
Publikováno v:
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
SAC305 solder paste is commonly used electronic assembly. This solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper and melts at 219 °C. The peak reflow temperature range is typically 240 - 260 °C. With electronic devices such as smartpho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::076c98cfd3e6a88f008cc927bf6ea02a
https://doi.org/10.1109/ectc.2017.105
https://doi.org/10.1109/ectc.2017.105
