Zobrazeno 1 - 10
of 25
pro vyhledávání: '"Hirofumi Ito"'
Publikováno v:
Journal of Smart Processing. 10:39-44
Publikováno v:
Journal of Materials Science: Materials in Electronics. 31:21389-21398
In this study, an effect of Al layer insertion to die-attach Ni–Sn joints with semiconductor chips by solid–liquid interdiffusion bonding on the stress and thermal cycling durability was investigated focusing on the purity of Al. The results show
Publikováno v:
IET Power Electronics. 12:492-497
Highly reliable operation at high temperatures is required for next-generation power modules in electric vehicles. We propose a joining concept involving nickel–tin (Ni–Sn) double solid–liquid interdiffusion with an aluminium (Al) sheet (Ni–S
Publikováno v:
SAE Technical Paper Series.
Autor:
Koichi Yamamoto, Masahiko Sekine, Tsuyoshi Imai, Yoshiki Nakamura, Hirofumi Ito, Takaya Higuchi, Ariyo Kanno
Publikováno v:
Journal of Japan Society of Civil Engineers, Ser. G (Environmental Research). 72:1-11
Autor:
Shinichi Iwakoshi, Takeshi Sato, Shinsaku Maeda, Hiroshi Anai, Hirofumi Ito, Shigeo Ichihashi, Hideyuki Nishiofuku, Yutaka Yoshiyama, Kimihiko Kichikawa, Toshihiro Tanaka, Tetsuya Masada
Publikováno v:
The Japanese Journal of Phlebology. 26:53-60
Publikováno v:
Journal of Applied Physics. 123:145109
High-temperature joint materials are indispensable to realizing next-generation power modules with high-output performance. However, crack initiation resulting from stress concentration in semiconductor chips joined with high-temperature joint materi
Autor:
Shiro Takada, Hirofumi Ito
Publikováno v:
Journal of Disaster Research. 2:349-358
In the Great Hanshin Earthquake, the severing of lifelines – utilities and infrastructures systems – heavily inconvenienced victims and caused serious rifts in emergency activities and medical and firefighting operations right after the earthquak
Publikováno v:
MATERIALS TRANSACTIONS. 48:1812-1815
Microstructures and mechanical properties of Cu mold-cast Ti 50 Cu 25 Ni 15 Sn 5 Ta 5 and Ti 42 Zr 5 Cu 44 Ni 5 Ta 1 alloys were investigated by means of X-ray diffraction, electron microscopy and compressive testing. Ti 55 Cu 22 Ni 15 Sn 5 Ta 5 allo
Publikováno v:
MATERIALS TRANSACTIONS. 48:1288-1291
Ti45Zr5Cu45Ni5 metallic glasses in which Ta and Al were substituted for Cu were evaluated in terms of mechanical properties, thermal properties and microstructures in order to determine the factors contributing to an improvement in plasticity. Sample