Zobrazeno 1 - 10
of 38
pro vyhledávání: '"Hiroaki Hokazono"'
Publikováno v:
Frattura ed Integrità Strutturale, Vol 12, Iss 46, Pp 25-33 (2018)
This study discusses an effect of additive elements on crack propagation behaviour for low-Ag contain Sn1.0Ag0.7Cu lead-free solders at high temperature. A cyclic push-pull loading tests for four kinds of Sn1.0Ag0.7Cu solders were conducted at 313 K
Externí odkaz:
https://doaj.org/article/c4abfdd58d3b4f7d9cfe744b0f288b7d
Publikováno v:
Journal of Smart Processing. 8:198-204
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8152147d18ff4982847089340fbee114
https://doi.org/10.7791/jspmee.8.198
https://doi.org/10.7791/jspmee.8.198
Autor:
Masao Sakane, Fumio Ogawa, Takamoto Itoh, Hideyuki Kanayama, Mitsuo Yamashita, Hiroaki Hokazono, Yutaka Konishi
Publikováno v:
International Journal of Fatigue. 116:180-191
The low-cycle-fatigue properties of lead-free solders based on Sn-1.0Ag-0.7Cu were investigated using miniature-sized specimens. Their mechanical properties were improved by adding bismuth, nickel, and germanium. The effects of additional elements up
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::fd21095cd71bed38b589097a15c1beb6
https://doi.org/10.1016/j.ijfatigue.2018.06.023
https://doi.org/10.1016/j.ijfatigue.2018.06.023
Autor:
Tatsuhiko Asai, Masaaki Koganemaru, Yuto Nanazoshi, Shunsuke Kawashita, Toru Ikeda, Hiroaki Hokazono
Publikováno v:
Journal of Smart Processing. 7:146-153
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1e7e922055f60ef0873941782cf0b9af
https://doi.org/10.7791/jspmee.7.146
https://doi.org/10.7791/jspmee.7.146
Publikováno v:
Journal of Smart Processing. 7:128-134
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e195ddbd44c345e857d7fbe2ddcd0a45
https://doi.org/10.7791/jspmee.7.128
https://doi.org/10.7791/jspmee.7.128
Publikováno v:
Procedia Engineering. 184:648-654
The aim of this study is to investigate degradation behaviors of the adhesion strength of the resin (bisphenol F-type epoxy resin)/metal interface under aging at high temperature. The adhesion strength of the Cu joint with the resin was investigated
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0544cdd12325763210b289b3ab1adf17
https://doi.org/10.1016/j.proeng.2017.04.132
https://doi.org/10.1016/j.proeng.2017.04.132
Publikováno v:
Journal of Smart Processing. 6:188-194
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::caf2a21663f66ec82eb8315d713b7fd7
https://doi.org/10.7791/jspmee.6.188
https://doi.org/10.7791/jspmee.6.188
Publikováno v:
Procedia Engineering. 184:238-245
Tensile and low cycle fatigue properties of Sn-5Sb (mass%) solder were investigated with miniature size tensile specimens. The effects of temperature and strain rate on tensile properties and the effect of temperature on low cycle fatigue properties
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::46a9b7038c635fa2661c8a78223008b6
https://doi.org/10.1016/j.proeng.2017.04.091
https://doi.org/10.1016/j.proeng.2017.04.091
Publikováno v:
Journal of the Society of Materials Science, Japan. 66:173-178
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e52a587e02541ec7066304f8862b295b
https://doi.org/10.2472/jsms.66.173
https://doi.org/10.2472/jsms.66.173
Publikováno v:
Materials Science Forum. 879:2377-2382
Tensile and low cycle fatigue properties of Sn-5Sb (mass%) solder were investigated with miniature size tensile specimens. The effect of temperature and strain rate on tensile properties and the effect of temperature on low cycle fatigue properties w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aede1331f89e67d6e447359bf8a97406
https://doi.org/10.4028/www.scientific.net/msf.879.2377
https://doi.org/10.4028/www.scientific.net/msf.879.2377