Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Hiroaki Doi"'
Publikováno v:
Journal of Robotics and Mechatronics. 29:801-807
In satellites, onboard software is required to perform complicated mission sequences and autonomous scheduling, conduct preliminary data processing, and manage various onboard devices. The dependability of onboard software strongly affects the reliab
Autor:
Kisaburo Azuma, Hiroaki Doi
Publikováno v:
Volume 6A: Materials and Fabrication.
Verification analyses of the CRACK-FEM developed to predict the propagation of age-related cracks detected in complicated-shaped components of nuclear power plants are presented. Four fatigue crack propagation tests for plate specimens with one and t
Publikováno v:
Journal of Spacecraft and Rockets. 46:226-229
Atomic oxygen concentration technology was investigated with two types of concentrators. One is a “horn-type” andtheotherisa“multiplering-type”concentrator.Bothofthemweredesignedwithacomputersimulationusinga hard-cube model. It was made clear
Fracture Estimation Method for Pipe with Multiple Circumferential Surface Flaws Subjected to Bending
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 75:56-63
Publikováno v:
Journal of Spacecraft and Rockets. 43:999-1003
Feasibility of atomic oxygen concentration in low Earth orbit space environment for material testing was studied. To maximize the concentration efficiency, trajectories of the atomic oxygen reflected at the reflector surface were computer-simulated b
Publikováno v:
JSME International Journal Series A. 47:62-69
The effect of stress on the magnetic performance of a giant magneto-resistive (GMR) head was investigated. The stress in the GMR head consists of residual stress caused by thin-film processing and thermal stress due to heat dissipation in the GMR ele
Autor:
Akio Yasukawa, Hiroaki Doi
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 69:1158-1165
A method for measuring residual sintering stress in glass-ceramic substrates with multilayer copper circuits has been investigated. This method uses the length of a crack produced from a Micro-Vickers impression on the substrate. First, the relation
Publikováno v:
The Proceedings of The Computational Mechanics Conference. :558-560
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 68:434-441
In flip-chip packages, bending deformation of the chip and substrates causes normal stress in the solder joints. In this paper, we study the influence of such normal stress on the flip-chip joint strength. Static loading tests and cyclic bending test
Publikováno v:
TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A. 68:936-941
In giant magneto-resistive (GMR) heads used for hard disk-drives, residual stress is caused by thin film processing, and thermal stress due to heat dissipation of the GMR elements. When the difference in in-plane principal stresses in the GMR element