Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Himanshu Modi"'
Publikováno v:
Dermatology and Therapy, Vol 14, Iss 12, Pp 3211-3227 (2024)
Abstract Introduction Patients with hidradenitis suppurativa (HS) experience significantly delayed diagnoses of 7–10 years from symptom onset on average, but the reasons for this remain largely unknown. This study investigated drivers of diagnostic
Externí odkaz:
https://doaj.org/article/ce26bbd1345349999c7e9053e23f9ab4
Autor:
Prajwal Murthy, Gautam Gupta, Joseph Herring, Jacob Lamotte-Dawaghreh, Krishna Bhavana Sivaraju, Pratik Bansode, Himanshu Modi, Dereje Agonafer, Poornima Mynampati, Mike Sweeney
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Due to increasing computational workload and thermal design power requirements of high power-density microelectronics, low heat carrying capacity and poor thermal conductivity of air renders air-cooling insufficient to meet the cooling demands of com
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3ac1d80a17a629570a196dd248a8977b
https://doi.org/10.1115/ipack2022-97402
https://doi.org/10.1115/ipack2022-97402
Autor:
Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Due to increased use of high-performance computing in datacenters to cater to huge workloads, old low-performance compute servers must be replaced endlessly with high-performance compute servers. Traditional air-cooling systems are insufficient to pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ec83397ff8cd9b95dee13dfd8c3908c
https://doi.org/10.1115/ipack2022-97494
https://doi.org/10.1115/ipack2022-97494
Autor:
Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
In recent years, there has been a significant increase in cloud computing, networking, virtualization, and storage applications, leading to an increase in demand for high-performance servers. The increase in performance demands is currently being met
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bdc26393762589d547ec24c38aae14a
https://doi.org/10.1115/ipack2022-97587
https://doi.org/10.1115/ipack2022-97587
Autor:
Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
Rising power densities at the server level due to increasing performance demands are being met by using efficient thermal management methods such as direct-to-chip liquid cooling. The use of cold plates that are directly installed yields a lower ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13d5f7b35c7d540a7f41a54d6d8420ab
https://doi.org/10.1115/ipack2022-97445
https://doi.org/10.1115/ipack2022-97445
Autor:
Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez
Publikováno v:
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
The rising demand for high-performance central and graphical processing units has resulted in the need for more efficient thermal management techniques like direct-to-chip liquid cooling. Direct Liquid Cooling using cold plates is one of the most eff
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4f1573e10261c22bd3b8e51512e3ce1
https://doi.org/10.1115/ipack2022-97434
https://doi.org/10.1115/ipack2022-97434
Publikováno v:
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ebdaba76bb04ced04ee59dfb3958c8a
https://doi.org/10.1109/itherm54085.2022.9899625
https://doi.org/10.1109/itherm54085.2022.9899625