Zobrazeno 1 - 10
of 18
pro vyhledávání: '"Hikari Murai"'
Autor:
Masato Miyatake, Tomio Iwasaki, Shin Takanezawa, Masaaki Takekoshi, Koji Morita, Hikari Murai, Shin-ichiro Abe, Shintaro Hashimoto, Tomohiko Kotake, Masahisa Ose
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 19:421-426
Autor:
Hikari Murai, Takehiro Michikawa, Takaaki Ito, Keiko Shinjo, Takehiro Suzuki, Kenichiro Hata, Keiko Nohara, Kazuyuki Okamura, Shota Takumi, Yutaka Kondo
Publikováno v:
Journal of Applied Toxicology. 36:105-112
Gestational exposure can affect the F2 generation through exposure of F1 germline cells. Previous studies reported that arsenite exposure of only F0 females during their pregnancy increases hepatic tumors in the F1 males in C3H mice, whose males are
Autor:
Shin Takanezawa, Hikari Murai, Masato Miyatake, Tomohiko Kotake, Masaaki Takekoshi, Taro Momozaki, Tetsuro Irino, Koji Morita
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 13:367-370
Autor:
Michiyo Matsumoto, Kana Ao, Yoshimi Miyamoto, Hikari Murai, Haruko Nagai, Chiharu Tohyama, Keiko Nohara, Takehiro Suzuki
Publikováno v:
Toxicology. 256:25-31
There is concern about the growing environmental levels of brominated dioxins. Brominated dioxins are known to bind and activate the transcription factor aryl hydrocarbon receptor (AhR), as their chlorinated congeners do. However, data on the potency
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 11:529-534
本研究は, 銅張積層板 (銅箔/FRP/銅箔) の銅箔部に生ずる残留応力に及ぼす多層化接着剤ならびに内層材の影響について検討した。具体的には, まず種々の接着剤ならびに種々の内層材を用
Autor:
Masaaki Takekoshi, Tomohiko Kotake, Masahisa Ose, Hikari Murai, Shin Takanezawa, Masato Miyatake
Publikováno v:
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
Along with the advancement in miniaturizing of mobile devices, typified by smart phones and tablet PCs, the semiconductor PKG substrate installed in these devices is demanded to be thinner and higher in density. As one of the most innovative solution
Publikováno v:
Circuit World. 27:7-11
Recently, the requirement of the printed wiring boards (PWBs) of environmental harmony type has risen rapidly. We have developed the core technologies of halogen‐free. They consist of resin system technology and high filler content technology. The
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 3:210-214
BGA (Ball Grid Array) やCSP (Chip Size/Scale Package) に用いられる半導体実装用プリント配線板に適用する低熱膨張・高弾性率基板材料 (E-679F) を開発した。E-679Fは, 新規な界面制御システムにより従
Autor:
Jiang Piyang, Masumi Ishizaka, Yuji Shimizu, Atsue Imamaki, Rena Nomura, Yoko Ito, Hikari Murai, Masatoshi Nakamura, Kaori Nakane, Kazuei Mita, Hideyuki Kajiwara, Tsuyoshi Kotake, Michihiko Shimomura, Fumio Togasaki
Publikováno v:
Journal of Electrophoresis. 50:39-41
A silkworm (Bombyx mori) proteome database (SPD) was constructed using Make-2DDB II software. The present SPD contains the proteomes of the seven major tissues in the silkworm: the middle silkglands, posterior silkglands, midguts, fat bodies, hemolym
Publikováno v:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits. 12:217-220