Zobrazeno 1 - 1
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pro vyhledávání: '"Hiew Pey Fang"'
Publikováno v:
2012 14th International Conference on Electronic Materials and Packaging (EMAP).
One of the key advantages to replace bare Cu wire with Pd Cu wire in semiconductor packages is to reduce corrosion risk against halogen from mold compound or substrate soldermask outgasing. However, existing wire bond recipe development methodology a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c08f02a34ec9b440e7284f5562c1308c
https://doi.org/10.1109/emap.2012.6507907
https://doi.org/10.1109/emap.2012.6507907
