Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Hideyuki Gotoh"'
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 6:99-103
Silver nanoparticle paste (SNP) was demonstrated to be a promising candidate as an alternative material to conventional silver electro-plating. The sintered film of SNP in a reductive atmosphere showed excellent bonding strength equivalent to the val
Autor:
Kazuki Tateyama, Yasunari Ukita, Masao Segawa, Yoshihiko Tojo, Hideyuki Gotoh, Katsuhisa Oosako
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 2:217-222
Lead-free materials are required to replace conventional lead-containing solder for environmental protection. The Pb-rich solder die mount material in a high-power transistor package is required to be replaced by a silver adhesive paste. The silver p
Publikováno v:
MATERIALS TRANSACTIONS. 46:704-708
This paper describes the effect of solvent evaporation and shrink in conductive adhesive. The adhesion mechanism of conductive adhesive strongly depends on the curing of the polymer matrix. The curing is preceded by polymer matrix chemical reactions,
Publikováno v:
JOURNAL OF THE BREWING SOCIETY OF JAPAN. 93:905-909
Publikováno v:
Veterinary parasitology. 151(1)
In vitro and in vivo studies were conducted to evaluate the effects of thiabendazole, mebendazole, levamisole and ivermectin against Gongylonema pulchrum. For in vitro assays, third-stage larvae (L3) incubated with the drugs were administered orally
Publikováno v:
The Journal of the Kyushu Dental Society. 53:753-754