Zobrazeno 1 - 10
of 296
pro vyhledávání: '"Hideyuki, YASUDA"'
Autor:
Hideyuki Yasuda, Kohei Morishita, Noriaki Nakatsuka, Tomohiro Nishimura, Masato Yoshiya, Akira Sugiyama, Kentaro Uesugi, Akihisa Takeuchi
Publikováno v:
Nature Communications, Vol 10, Iss 1, Pp 1-8 (2019)
Transitioning from columnar to equiaxed grains is paramount for desired microstructures during steel casting. Here, the authors report a new fragmentation mechanism based on a phase transition at grain boundaries that can contribute to equiaxed grain
Externí odkaz:
https://doaj.org/article/24814b890b8444d69b5bc5a4227c98fb
Autor:
Vizureanu, Siti Farahnabilah Muhd Amli, Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Hideyuki Yasuda, Kazuhiro Nogita, Mohd Mustafa Al Bakri Abdullah, Ovidiu Nemes, Andrei Victor Sandu, Petrica
Publikováno v:
Materials; Volume 16; Issue 12; Pages: 4360
The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated.
Autor:
Dewi Suriyani Che Halin, Kamrosni Abdul Razak, Mohd Arif Anuar Mohd Salleh, Mohd Izrul Izwan Ramli, Mohd Mustafa Al Bakri Abdullah, Ayu Wazira Azhari, Kazuhiro Nogita, Hideyuki Yasuda, Marcin Nabiałek, Jerzy J. Wysłocki
Publikováno v:
Magnetochemistry, Vol 7, Iss 1, p 14 (2021)
Ag/TiO2 thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO2 thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing
Externí odkaz:
https://doaj.org/article/ea88f1d75dad40ac9f6d9b4cc740a835
Publikováno v:
Solid State Phenomena. 327:127-132
To gain better understanding of rheological transitions from suspension flow to granular deformation and shear cracking, this research conducted shear-deformation on globular semi-solid Al-Cu alloys to study the rheological behavior of semi-solid as
Autor:
Qinfen Gu, Zebang Zheng, Kazuhiro Nogita, Shiqian Liu, Guang Zeng, Stuart McDonald, Hideyuki Yasuda
Publikováno v:
Acta Metallurgica Sinica (English Letters). 35:49-66
It is widely accepted that further development of Pb-free solder alloys for improved processing and in-service properties of next-generation electronics, can be accelerated through a fundamental understanding of phase transformation and microstructur
Publikováno v:
ISIJ International. 61:1879-1888
A random sampling method using Fe-19.9 mass% Cr-24.8 mass% Ni-4.5 mass% Mo-1.5 mass% Cu alloy quenched during unidirectional solidification was applied to examine the measurement accuracy of the solute partition coefficients between the solid and liq
Publikováno v:
ISIJ International. 61:1872-1878
Publikováno v:
ISIJ International. 61:1567-1578