Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Hidetoshi Kitaura"'
Publikováno v:
Journal of Materials Science. 54:10998-11008
The miniaturization and high functionalization of electronic devices are driving the micronization of electronic components. In order to effectively microjoin electronic components, it is necessary to micronize the particles used in the soldering pas
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 888:218-221
A new production process allows a direct bonding of HOPG crystals on Si wafers. This new method facilitates the production of analyzer crystals with support structure without the use of additional, background inducing fixation material, e.g. glue, wa
Autor:
Hidetoshi Kitaura, Kiyohiro Hine, Keisuke Uenishi, Akio Furusawa, Shigeaki Sakatani, Masato Mori
Publikováno v:
Journal of Japan Institute of Electronics Packaging. 19:177-183
Autor:
Saumya Mukherjee, Naomi Nishiki, Michael Schneider, Peter Böni, Hidetoshi Kitaura, C. Schanzer
Publikováno v:
Proceedings of the International Conference on Neutron Optics (NOP2017).
Autor:
Takeshi Yamamoto, Takashi Ishii, Zuhair A. Munir, Manshi Ohyanagi, Hidetoshi Kitaura, Yasuhiro Kodera
Publikováno v:
Journal of the American Ceramic Society. 87:1436-1441
Nanostructured β-SiC, with crystallite size in the range of 5–20 nm in agglomerates of 50–150 nm, was formed by reactive high-energy ball milling and consolidated to a relative density of 98% by sintering at 1700°C without the use of additives.
Autor:
Zuhair A. Munir, Takeshi Yamamoto, Takeshi Ishii, Hidetoshi Kitaura, Yasuhiro Kodera, Manshi Ohyanagi
Publikováno v:
Scripta Materialia. 50:111-114
Sintering of nanostructured cubic SiC to 98% relative density is accomplished without the use of additives or very high pressures. Evidence demonstrating the role of a disorder–order transformation in the densification process is provided.