Zobrazeno 1 - 4
of 4
pro vyhledávání: '"Hideo Ohkuma"'
Autor:
Uichi Itoh, Tetsuro Nishimura, Takuro Fukami, Akira Kita, Kenji Takamura, Ryosuke Miyabayashi, Hideo Ohkuma
Publikováno v:
2014 IEEE 40th Photovoltaic Specialist Conference (PVSC).
There are many kinds of solder joint failure modes in the crystalline Si modules which have been operated in Tsukuba, Japan for 10 years. The modules including mono crystal, multi crystal and hetero junction structure were supplied from four differen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdac42e26772b17eaed0d015d187a3f1
https://doi.org/10.1109/pvsc.2014.6925323
https://doi.org/10.1109/pvsc.2014.6925323
Publikováno v:
QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 15:584-590
In high frequency electrodes that are composed with a metal substrate and a dielectric coating layer, it is important to clearify the bonding between the metal substrate and the dielectric coating layer and to produce a low dielectric coating layer f
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82158d4ffe5cf9adf3718ed87d34c05f
https://doi.org/10.2207/qjjws.15.584
https://doi.org/10.2207/qjjws.15.584
Publikováno v:
2009 IEEE 13th International Symposium on Consumer Electronics.
We reported the material properties, that we use in the numerical analysis, controls the quality of the analysis result directly in our previous paper.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2c47568ea3f1a1d2c31342c8420f31f3
https://doi.org/10.1109/isce.2009.5157052
https://doi.org/10.1109/isce.2009.5157052
Publikováno v:
SID Symposium Digest of Technical Papers. 31:168-169
Thin and lightweight liquid crystal displays (LCDs) are strongly required, especially for portable PC products. In order to achieve this, we developed a new manufacturing process that reduces the cell thickness to 1.0 mm for 13′ TFT LCD products. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::23066eb59e63720e950c6e67d82b6e49
https://doi.org/10.1889/1.1832909
https://doi.org/10.1889/1.1832909