Zobrazeno 1 - 10
of 44
pro vyhledávání: '"Hidenori Ohta"'
Publikováno v:
Japanese Journal of Neurosurgery. 20:133-138
Publikováno v:
Journal of Information Processing. 18:138-146
In these years, 3D-LSIs which consist of several silicon layers have been developed and attracted attention. For floorplaning of 3D-LSIs, a rectangular solid dissection, which is a dissection of a rectangular solid into smaller rectangular solids by
Publikováno v:
IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences. :2111-2119
A 3D-dissection (A rectangular solid dissection) is a dissection of a rectangular solid into smaller rectangular solids by planes. In this paper, we propose an O-sequence, a string of representing any 3D-dissection which is dissected by only non-cros
Publikováno v:
Electronics and Communications in Japan (Part II: Electronics). 90:73-83
In order to establish encrypted communications in deployable sensor networks, it is essential that encryption keys be shared between nodes. However, the sharing of keys is not simple given the restricted resources of such devices. In recent years, se
Autor:
Akamatsu Tetsuro, Toshihiro Matsuoka, Suguru Hode, Kenji Najima, Kuri Shuhei, Asada Kazuo, Saida Tomikane, Sakaguchi Yasuhiro, Kunio Maruoka, Mitsuhiro Irino, Takayuki Irie, Katsunari Ohsono, Hidenori Ohta
Publikováno v:
Journal of Nuclear Fuel Cycle and Environment. 9:73-80
Publikováno v:
Transactions on Engineering Technologies ISBN: 9789401791144
The circle-packing problem is a problem of packing circles into a two dimensional area such that none of them overlap with each other. Each of the former methods has its own difficulty; some of them are only applicable to the case that the area the c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6b2fb56c596660a2f54e819c3b8a04e5
https://doi.org/10.1007/978-94-017-9115-1_54
https://doi.org/10.1007/978-94-017-9115-1_54
Publikováno v:
2012 IEEE 3rd Latin American Symposium on Circuits and Systems (LASCAS).
Since semiconductor manufacturing technology has improved, LSIs which consist of several silicon chips (silicon layers) have been put to practical use. Then, signal delay and power consumption are reduced, because wires on different silicon layers ar
Autor:
Kunihiro Fujiyoshi, Hidenori Ohta
Publikováno v:
ISCAS
Recently, 3D-LSIs which consist of several silicon layers have been developed and have attracted attention. 3D-LSI has an advantage of the length of wires and the number of components per chip. However, a layout design of the 3D-LSIs will be much com
Autor:
Hidenori Ohta
Publikováno v:
Neurologia medico-chirurgica. 30:16-23
Cerebral blood flow (CBF) was measured in 90 patients who underwent early aneurysmal clipping after subarachnoid hemorrhage (SAH). Measurements were made by a noninvasive, two-dimensional method involving intravenous injection of 133Xe. Patients of H
Publikováno v:
SASN
Pairwise key establishment is a fundamental service provided in secure sensor networks. However, due to resource constraints, establishing pairwise keys is not a trivial task. Recently, a random key pre-distribution scheme and its improvements have b