Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Hidemitsu Okabe"'
Publikováno v:
Tribology Online, Vol 3, Iss 5, Pp 248-253 (2008)
This study aims to clarify the interaction between a silicon wafer and individual diamond abrasives in grinding to support the estimation of optimal grinding conditions for minimizing the subsurface damages and maximizing the removal rate. In this pa
Externí odkaz:
https://doaj.org/article/ff5b3883900f4192a7e4a44ffbec529a
Publikováno v:
Key Engineering Materials. 329:379-384
This study aims to clarify the interaction between Si wafer and individual diamond abrasives in grinding at nanometer level and to estimate the grinding conditions for minimizing the surface defect. This paper reports on the results obtained through
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b610ecb075b7bf5293d43197dbc2296
https://doi.org/10.4028/www.scientific.net/kem.329.379
https://doi.org/10.4028/www.scientific.net/kem.329.379
Publikováno v:
The Proceedings of The Manufacturing & Machine Tool Conference. :99-100
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7def5fb90d05022b06f3c2fa4abbf501
https://doi.org/10.1299/jsmemmt.2006.6.99
https://doi.org/10.1299/jsmemmt.2006.6.99
Publikováno v:
The Proceedings of Ibaraki District Conference. 2005:223-224
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9d0427842bb5cf049a376a926c131efe
https://doi.org/10.1299/jsmeibaraki.2005.223
https://doi.org/10.1299/jsmeibaraki.2005.223
Publikováno v:
The Proceedings of Ibaraki District Conference. 2004:5-6
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17bc871cb75515c475003fccf5f14462
https://doi.org/10.1299/jsmeibaraki.2004.5
https://doi.org/10.1299/jsmeibaraki.2004.5