Zobrazeno 1 - 2
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pro vyhledávání: '"Hideko Mukaida"'
Autor:
Keiichi Sawa, Takashi Maeda, Masayuki Miura, Fujisawa Toshio, Mie Matsuo, Hideko Mukaida, Hideto Horii, Tomoya Sanuki, Fumie Kikushima, Hitomi Tanaka, Yuta Aiba
Publikováno v:
2021 IEEE International Memory Workshop (IMW).
We propose the storage systems incorporating 3D Flash memory in a cryogenic condition. In this paper, we investigate details of the cell characteristics and storage performance at cryogenic temperature. Several new results are obtained in addition to
Publikováno v:
2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The idea of the Weibull stress, which is based on the “local approach”, has been applied to delamination failure analyses of semiconductor packages. Interface fracture strengths between package mold resin and 42 alloy lead frame are obtained by a