Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Heung-Sup Chun"'
Publikováno v:
Journal of Electronic Materials. 29:1233-1240
Chip scale packages (CSP) have essential solder joint quality problems, and a board level reliability is a key issue in design and development of the CSP type packages. There has been an effort to eliminate Pb from solder due to its toxicology. To ev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ed67b442710737b47e690db06d881b82
https://doi.org/10.1007/s11664-000-0018-3
https://doi.org/10.1007/s11664-000-0018-3
Autor:
Hyo-Seog Ryu, Jo-Han Kim, Joong-Sik Ki, Young-Suk Suh, Yong-Ju Kim, Heung-Sup Chun, Jae-Kyung Wee
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
In this paper, three s-parameter based techniques of meandering traces modeled on uniform transmission line model, optimized /spl Pi/-network model, and the Cauer network synthesis technique, are presented to obtain time-domain responses using time d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7f04a8fb321c2526df50f5a886bba1bf
https://doi.org/10.1109/ectc.2001.928029
https://doi.org/10.1109/ectc.2001.928029
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
Hyundai Electronics has developed the wafer level chip size package, named Omega CSP, to provide the right package solution for mobile electronics products that require light weight, small size and low cost. The aim of this paper is to report both th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::22934eafba8a6d5ae9dc23e33538561e
https://doi.org/10.1109/ectc.2001.928016
https://doi.org/10.1109/ectc.2001.928016
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Six types of under bump metallurgies (UBM) were investigated in terms of ball shear strength, fracture surface analysis, the adhesion of sputter-deposited metal to dielectric polymer, and microstructure observation to optimize the UBM of a wafer leve
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f34458ac1c4144e1398d95f92bc6d13
https://doi.org/10.1109/ectc.2000.853260
https://doi.org/10.1109/ectc.2000.853260
Publikováno v:
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
CSP (Chip Size Package) is expected to be widely used in D-RDRAM (Direct Rambus DRAM) for its higher electrical performance as well as in PDA (Personal Digital Assistant) applications for its smaller size and lighter weight. Especially wafer level CS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::097c523beeebcb9fbeeb0bb4a61ff88b
https://doi.org/10.1109/ectc.2000.853167
https://doi.org/10.1109/ectc.2000.853167
Autor:
Seungyoung Ahn, Junwoo Lee, Kwang Seong Choi, Joon-Ki Hong, Woonghwan Ryu, Jae Myun Kim, Heung-Sup Chun, Baekkyu Choi, Joungho Kim
Publikováno v:
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).
A wafer level package (WLP) has been developed as a cost effective packaging method compared to the /spl mu/BGA package, and especially applied to the Rambus DRAM (RDRAM) package. The maximum allowable thickness of the stress buffer layer on the WLP
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4412456872232082828bbfcda794675d
https://doi.org/10.1109/ectc.2001.927707
https://doi.org/10.1109/ectc.2001.927707
Autor:
Yong-Ju Kim, Jo-Han Kim, Hyo-Seog Ryu, Young-Suk Suh, Jae-Kyung Wee, Heung-Sup Chun, Joong-Sik Ki
Publikováno v:
2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p1463-1467, 5p
Autor:
Junwoo Lee, Baekkyu Choi, Seungyoung Ahn, Woonghwan Ryu, Jae Myun Kim, Kwang Seong Choi, Joon-Ki Hong, Heung-Sup Chun, Joungho Kim
Publikováno v:
2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p128-132, 5p
Publikováno v:
2000 Proceedings 50th Electronic Components & Technology Conference (Cat. No.00CH37070); 2000, p844-849, 6p
Publikováno v:
2000 Proceedings 50th Electronic Components & Technology Conference (Cat. No.00CH37070); 2000, p301-310, 10p