Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Herve Boutry"'
Autor:
Herve Boutry, Chevalier Lionel, Vincent Mandrillon, Antoine Nowodzinski, Didier Bloch, R. Franiatte, David Bouchu, Karine Rousseau
Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Failure analyses on μinsert technology used for 2.5D stacking are carried out after 1000 hours of damp heat test on nickel, copper and gold-nickel μinserts. We show that nickel μinserts are prone to delamination when the force applied on the repor
Autor:
Sophie Verrun, Remy Franiatte, Vincent Mandrillon, Antoine Nowodzinski, Romain Anciant, Herve Boutry, Gilles Simon
Publikováno v:
2012 International Semiconductor Conference Dresden-Grenoble (ISCDG).
Micro-insert technology is a wafer level stacking technology offering main advantages such as simplicity, low cost and compatibility with chip assembly technologies. This paper presents recent preliminary reliability tests results. Thermal cycling te
Autor:
Kenneth Rodgers, Alan Mathewson, Herve Boutry, R. Franiatte, N. Sillon, Frank Stam, Frederic Rothan, Thierry Hilt, Ningning Wang, Cian O'Mathuna
This paper reports on the design and the manufacturing of an integrated DCDC converter, which respects the specificity of sensor node network: compactness, high efficiency in acquisition and transmission modes, and compatibility with miniature Lithiu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b92f4bb40f05fafd17d9a41e0816f61d
https://hdl.handle.net/10468/474
https://hdl.handle.net/10468/474
Autor:
B. Dubois-Bonvalot, N. Sillon, F. Depoutot, Jean Brun, A. Nowodzinski, C. Schmidt, M. Simon, Frank Altmann, Herve Boutry
Publikováno v:
2009 59th Electronic Components and Technology Conference.
In many complex systems under development, the cost of integration and the compromises in performance that can result from the integration process can become prohibitive. Therefore, the establishment of a technology which enables the system level int
Publikováno v:
2009 59th Electronic Components and Technology Conference.
Three-dimensional die stacking with vertical interconnections through Si dies is potentially the best semiconductor system integration technique. With its incredibly promising improvements in speed and power dissipation in IC's, it has attracted incr