Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Herman Itzkowitz"'
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2010:001030-001053
Thin wafers have become a basic need for a wide variety of new microelectronic products. Thinner die are being required to fit into thinner packages. Wafers that have been thinned using a final wet etch process on the backside have less stress compar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::96fb0c0ac82b95097b5109b2af9b644a
https://doi.org/10.4071/2010dpc-tp33
https://doi.org/10.4071/2010dpc-tp33
