Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Herbert J. Neuhaus"'
Autor:
Herbert J. Neuhaus, Charles E. Bauer
Publikováno v:
2017 International Conference on Electronics Packaging (ICEP).
With all the excitement around IoT (Internet of Things), big data and cognitive computing the impact of wearable electronics on the manufacturing environment frequently gets lost in the noise. However, all of these trends create many new and exciting
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dee989ca37e145f0ff780afb5bedc6a4
https://doi.org/10.23919/icep.2017.7939381
https://doi.org/10.23919/icep.2017.7939381
Autor:
Herbert J. Neuhaus, Charles E. Bauer
Publikováno v:
Microelectronics Reliability. 53:1179-1182
Embedding active and passive components in an interconnect substrate offers improved performance by cutting interconnect parasitics, reliability gains through elimination of wire-bonds and solder-bumps, and reduced cost and size via parts list reduct
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f88ef77b96941d55b7c4224af2a3a0e7
https://doi.org/10.1016/j.microrel.2013.07.106
https://doi.org/10.1016/j.microrel.2013.07.106
Autor:
Charles E. Bauer, Herbert J. Neuhaus
Publikováno v:
2013 14th International Conference on Electronic Packaging Technology.
The evolutionary developments in integrated circuits predicted by Moore's Law apply steady pressure on packaging, interconnect, and assembly to deliver finer geometry. As conventional technology, such as subtractive PWB patterning and chips-last asse
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11b2ebe4291504c0c873b7b579207caf
https://doi.org/10.1109/icept.2013.6756559
https://doi.org/10.1109/icept.2013.6756559
Publikováno v:
2010 12th Electronics Packaging Technology Conference.
Advanced packaging conferences, technical articles, and editorials frequently focus on high pin count devices such as microprocessors and graphic processor devices. The substantial challenges incumbent on high I/O package designs warrant this attenti
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7d8bac9833b393d1b11b8b21404699a2
https://doi.org/10.1109/eptc.2010.5702625
https://doi.org/10.1109/eptc.2010.5702625
Autor:
Herbert J. Neuhaus, Charles E. Bauer
Publikováno v:
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
Embedding active devices in the circuit board offers improved performance by cutting interconnect parasitics, reliability gains by eliminating wire-bonds and solder-bumps, and reduced cost and size by parts list reduction. Like every new development,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5fc8cc92316eb1918bb6130bdf37621b
https://doi.org/10.1109/impact.2010.5699675
https://doi.org/10.1109/impact.2010.5699675
Autor:
Charles E. Bauer, Herbert J. Neuhaus
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
For more than a decade the industry has recognized the power of the third dimension in package and sub-system assembly for the implementation of highly integrated mobile electronic products. Numerous approaches have been reported and demonstrated inc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8b2a13de9d8df1e107a9795c458de064
https://doi.org/10.1109/eptc.2009.5416508
https://doi.org/10.1109/eptc.2009.5416508
Publikováno v:
2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.
Early MEMS devices employed packages developed for conventional semiconductor microelectronics. Today, MEMS packages reflect the unique environment, mechanical, chemical and thermal requirements of MEMS devices themselves. A casual search of on-line
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92d84e476627d30d8b62a9940ca18f36
https://doi.org/10.1109/impact.2009.5382176
https://doi.org/10.1109/impact.2009.5382176
Publikováno v:
ASME 2009 InterPACK Conference, Volume 1.
Early MEMS devices employed packages developed for conventional semiconductor microelectronics. Today, MEMS packages reflect the unique environment, mechanical, chemical and thermal requirements of MEMS devices themselves. A casual search of on-line
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::886c571cfa69e20312dca235d5a2685b
https://doi.org/10.1115/interpack2009-89291
https://doi.org/10.1115/interpack2009-89291
Publikováno v:
ACS Symposium Series ISBN: 9780841216792
Polymeric Materials for Electronics Packaging and Interconnection
Polymeric Materials for Electronics Packaging and Interconnection
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77e323db45a5e3b74104f6c68aa24854
https://doi.org/10.1021/bk-1989-0407.ch015
https://doi.org/10.1021/bk-1989-0407.ch015
Publikováno v:
ACS Symposium Series ISBN: 9780841216792
Polymeric Materials for Electronics Packaging and Interconnection
Polymeric Materials for Electronics Packaging and Interconnection
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1b7d199c862de48f33f945378bb64f84
https://doi.org/10.1021/bk-1989-0407.ch008
https://doi.org/10.1021/bk-1989-0407.ch008