Výsledky vyhledávání - "Herbert Guttler"

Location of the Critical Solder Joint of a PBGA under Temperature Cycling Load for SAC and SnPb Solder. Results of Experiments vs. FE-Simulations on System and Board Level

Autor: Ulrich Becker, Herbert Guttler, Manfred Spraul, Natalja Schafet, Bruno Schrempp

Publikováno v: International Symposium on Microelectronics. 2011:000409-000417

PBGAs with SnPb and SnAgCu (SAC) solder joints were stressed with temperature cycles on board- and system-level. A significant influence of the different solder materials on the location of the most damaged PBGA solder balls was observed in the exper

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::e2acc051f49138b88430d4c4467c2def
https://doi.org/10.4071/isom-2011-tp6-paper3

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Development of a submodel technique for the simulation of solder joint fatigue of electronic devices mounted within an assembled ECU

Autor: Christian D. Lemm, Philipp Schmid, Natalja Schafet, Herbert Guttler, Ulrich Becker

Publikováno v: EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (Electronic Control Unit) depends on the thermal expansion mismatc

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::1eca356242dda2fd5d9686bddbe24cc6
https://doi.org/10.1109/esime.2009.4938415

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