Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Herbert Guttler"'
Publikováno v:
International Symposium on Microelectronics. 2011:000409-000417
PBGAs with SnPb and SnAgCu (SAC) solder joints were stressed with temperature cycles on board- and system-level. A significant influence of the different solder materials on the location of the most damaged PBGA solder balls was observed in the exper
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e2acc051f49138b88430d4c4467c2def
https://doi.org/10.4071/isom-2011-tp6-paper3
https://doi.org/10.4071/isom-2011-tp6-paper3
Publikováno v:
EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
The thermomechanical fatigue of solder joints on the system level is more complex to predict than on the board level. The damage of the solder joints of an electronic device in an ECU (Electronic Control Unit) depends on the thermal expansion mismatc
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1eca356242dda2fd5d9686bddbe24cc6
https://doi.org/10.1109/esime.2009.4938415
https://doi.org/10.1109/esime.2009.4938415
Autor:
Toumi, S.1,2 (AUTHOR) s.toumi@univ-boumerdes.dz, Ouennoughi, Z.1 (AUTHOR), Weiss, R.3 (AUTHOR)
Publikováno v:
Applied Physics A: Materials Science & Processing. Sep2021, Vol. 127 Issue 9, p1-8. 8p. 12 Graphs.
The papers collected in this volume represent the work of the Permanent Court of Arbitration's 7th International Law Seminar, Resolution of Cultural Property Disputes, held at the Peace Palace in The Hague in the spring of 2003 and attended by world-
Conference
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