Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Heon Yul Ryu"'
Autor:
Nagendra Prasad Yerriboina, Jin-Goo Park, Heon Yul Ryu, Palwasha Jalalzai, Tae-Gon Kim, Satomi Hamada
Publikováno v:
Solid State Phenomena. 314:270-274
A systematic study of the adsorption of benzotriazole on Co surface and its removal in aqueous solutions was carried out for post-CMP cleaning application. Static etch rate (SER) measurements and electrochemical impedance spectroscopy (EIS) were empl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e719dfa61204d176d4a27c4f4224b0de
https://doi.org/10.4028/www.scientific.net/ssp.314.270
https://doi.org/10.4028/www.scientific.net/ssp.314.270
Autor:
Heon-Yul Ryu, Yeon-Ah Jeong, Jae-Gon Choi, Nagendra Prasad Yerriboina, Jong-Dai Park, Seong-Jun Han, Chang-Yong Park, Tae-Gon Kim, Jung-Hwan Lee, Maneesh Kumar Poddar, Jae-Hyun Kim, Lee Min-Gun, Jin-Goo Park
Publikováno v:
Journal of Materials Science. 55:3450-3461
Chemical mechanical polishing (CMP) is one of the important steps that involves during fabrication of semiconductor devices. This research highlights the importance of tungsten (W) polishing slurries consisting of a novel nonionic, heat-activated FeS
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::210e88e55022af6a58310beacd0bcf45
https://doi.org/10.1007/s10853-019-04239-4
https://doi.org/10.1007/s10853-019-04239-4
Publikováno v:
Electronic Materials Letters. 15:357-362
Pad conditioners are important consumables for semiconductor chemical mechanical planarization processes. Recently, a new concept has been developed to improve the performance and lifetime of a pad conditioner by depositing diamond film on a uniforml
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8be60056c36e794bd0b5011bbd4eca26
https://doi.org/10.1007/s13391-019-00123-0
https://doi.org/10.1007/s13391-019-00123-0
Autor:
Satomi Hamada, Yutaka Wada, Nagendra Prasad Yerriboina, Tae-Gon Kim, Hirokuni Hiyama, Jin-Goo Park, Jun-Kil Hwang, Heon-Yul Ryu, Jung-Hwan Lee
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P307-P312
Polyvinyl acetal (PVA) brush cleaning is one of the most important processes in the post chemical mechanical planarization (CMP) cleaning process. However, PVA brush could be severely contaminated due to strong direct contact with a large amount of a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d2be1d2cbd638d5ce8c9f1aeeaafda51
https://doi.org/10.1149/2.0111906jss
https://doi.org/10.1149/2.0111906jss
Autor:
Heon-Yul Ryu, Yutaka Wada, Nagendra Prasad Yerriboina, Chan-Hee Lee, Jun-Kil Hwang, Jin-Goo Park, Hirokuni Hiyama, Byoung-Jun Cho, Satomi Hamada
Publikováno v:
ECS Journal of Solid State Science and Technology. 8:P3058-P3062
This research was supported by Ansan-Si hidden champion fostering and supporting project funded by Ansan city.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::492ecd830b135664fdac00692c448cb9
https://doi.org/10.1149/2.0101905jss
https://doi.org/10.1149/2.0101905jss
Effect of Slurry Additives on Co-BTA Complex Stability and Inhibition Property During Co CMP Process
Autor:
Palwasha Jalalzai, Heon-Yul Ryu, Samrina Sahir, Ranjith Punathil Meethal, Satomi Hamada, Tae-Gon Kim, Jin-Goo Park
Publikováno v:
ECS Journal of Solid State Science and Technology. 11:084006
The stability of the cobalt surface after the CMP process is crucial to prevent the corrosion of the surface during the wafer transfer step. The stability of the Co-BTA complex is investigated in this work by using various experimental and surface an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ec52c16f41aebdf613ebd9c00f5e7be
https://doi.org/10.1149/2162-8777/ac8833
https://doi.org/10.1149/2162-8777/ac8833
Autor:
Heon-Yul Ryu, Chi Ho Lee, Sang Uck Lee, Satomi Hamada, Nagendra Prasad Yerriboina, Jin-Goo Park
Publikováno v:
Microelectronic Engineering. 262:111833
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::937894f6fa57e0b857339257c2bcb9a1
https://doi.org/10.1016/j.mee.2022.111833
https://doi.org/10.1016/j.mee.2022.111833
Autor:
Heon-Yul Ryu, Hirokuni Hiyama, Satomi Hamada, Yutaka Wada, Tae-Gon Kim, Nagendra Prasad Yerriboina, Jin-Goo Park
Publikováno v:
2020 China Semiconductor Technology International Conference (CSTIC).
Corrosion inhibitor plays a key role during Chemical mechanical planarization (CMP) of metal surfaces during semiconductor processing. Strong metal-inhibitor passivation formation during the CMP process and its easy removal during post-CMP cleaning a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e23fdfd5de86f65d14a9c5e1228c2e1a
https://doi.org/10.1109/cstic49141.2020.9282467
https://doi.org/10.1109/cstic49141.2020.9282467
Autor:
Heon-Yul Ryu, Myeong-Jun Kim, Jin-Goo Park, Ramanathan Srinivasan, Nagendra Prasad Yerriboina
Publikováno v:
Electronic Materials Letters. 15:7-17
This study presents an efficient method for fabricating a stainless-steel metal mask with through hole arrays. The electrochemical interactions between the electrolyte and metal surface were analyzed by linear scan voltammetry (LSV) and electrochemic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9d0780af0edee41e8c73c1028c0472b
https://doi.org/10.1007/s13391-018-0096-0
https://doi.org/10.1007/s13391-018-0096-0
Publikováno v:
Journal of Adhesion Science and Technology. 32:1975-1986
In this study, we have demonstrated a simple and inexpensive process to fabricate electrowetting lens arrays with various curvatures (micron to submicron) on conductive and transparent polydimethylsiloxane (PDMS) molds without additional metal layers
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d421c08abb6b67d63a65f81f0ddc4774
https://doi.org/10.1080/01694243.2018.1461447
https://doi.org/10.1080/01694243.2018.1461447