Zobrazeno 1 - 1
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pro vyhledávání: '"Henrik Rödjegaård"'
Publikováno v:
ECS Transactions. 3:355-366
Bonding is one of the most important tools for the fabrication of Silicon On Insulator (SOI) material and building of MicroElectroMechanical Systems (MEMS). Nevertheless, the most significant limitation in prevalent bonding processes pertains to the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::183edb9bbc5140eecdf4bbe8264866a5
https://doi.org/10.1149/1.2357086
https://doi.org/10.1149/1.2357086
