Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Henri Seppaenen"'
Publikováno v:
International Symposium on Microelectronics. 2020:000222-000229
A modeling approach is developed to better describe the relation between input electrical power and the physical reaction of the bonding system during ultrasonic bonding. The major distinction between this analysis and previously published works is t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7b03ee43ce2dc1ee8c1aa454a66ce9a
https://doi.org/10.4071/2380-4505-2020.1.000222
https://doi.org/10.4071/2380-4505-2020.1.000222
Publikováno v:
International Symposium on Microelectronics. 2016:000433-000437
Operators of ultrasonic wedge bonders desire that bonders using the same process inputs achieve identical process outputs. In practice, it has been found that process outputs can differ between bonders operating with the same inputs. A common practic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::572c995619ceefa8d39af31115936b82
https://doi.org/10.4071/isom-2016-tha32
https://doi.org/10.4071/isom-2016-tha32