Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Henri Seppänen"'
Publikováno v:
Journal of Materials Science. 57:20957-20973
Publikováno v:
International Symposium on Microelectronics. 2021:000256-000259
K&S developed and tested the Advanced Process Diagnostics (APD) algorithm to classify bonding outliers in ultrasonic wire bond production. APD is a software feature, part of Kulicke & Soffa wedge bonders to measure and analyze process signals and det
Autor:
Henri Seppänen
Publikováno v:
International Symposium on Microelectronics. 2020:000160-000164
Plastic frame power modules with press-fitted or molded pins create challenging bonding conditions. Pin stability variations, from relatively stable to unstable within a single power module, makes it difficult to find process parameters that fit to a
Autor:
Henri Seppänen
Publikováno v:
International Symposium on Microelectronics. 2016:000398-000401
In power electronics modules, ultrasonic wire bonding is a common method to make electronic connections between the connector pins and the IGBTs. In these modules the connector pins are often residing on top of the plastic frame. Due to the pins bein
Publikováno v:
Computational Materials Science. 170:109149
With the use of molecular dynamics simulations, the contact between two substrates made of the same material is investigated for three different fcc metals: Al, Cu, and Ag. For this purpose, two misoriented substrates containing (1 1 1) planes parall
Autor:
Petri Toivanen, Antti Nuottajärvi, Timo Rauhala, J. Kauppinen, Mihkel Pajusalu, Jaanus Kalde, Olli Tarvainen, Henri Seppänen, Matis Averin, Taneli Kalvas, Pekka Janhunen, S.K. Kiprich, Kaspars Laizans, Viljo Allik, Henri Kuuste, Hannu Koivisto, Edward Hæggström, Erik Ilbis, Jukka Ukkonen, Jouni Envall
Publikováno v:
Proceedings of the Estonian Academy of Sciences. 63(2):210-221
The scientific mission of ESTCube-1, launched in May 2013, is to measure the electric solar wind sail (E-sail) force in orbit. The experiment is planned to push forward the development of the E-sail, a propulsion method recently invented at the Finni
Publikováno v:
Microelectronic Engineering. 104:114-119
We prove that we can, using contact resistance as a tool, determine the instant when the bonding process starts, i.e. microwelds start to form during ultrasonic bonding. This knowledge permits us to reduce the uncertainty in the estimated bonded area
Autor:
Aino Tietäväinen, Risto Kurppa, Edward Hæggström, Antti Meriläinen, Timo Rauhala, Henri Seppänen
Publikováno v:
Microelectronics Reliability. 54:1452-1454
We employ a real-time nondestructive contact resistance method to rapidly predict the end state of ultrasonic wire bonds. We classified 64 bonds as either successful (bond attached) or failed (bond unattached) with a support vector machine method. Th
Bonding quality monitoring applying statistical modeling of Scanning White Light Interferometry data
Publikováno v:
Microelectronic Engineering. 84:2757-2768
Scanning White Light Interferometry (SWLI) is an optical and hence non-destructive solution to precisely measure surface profiles, while bonding profiles yield information about the bond quality as determined by the pull force required to break the m
Autor:
Henri Seppänen, Heimo Saarikko, Ivan Kassamakov, Pasi Vihinen, Markku Oinonen, Zoran Radivojevic
Publikováno v:
Microelectronics Reliability. 46:116-123
An advanced method for the quality assessment of microelectronic assemblies has been developed by combining IR thermography and several techniques for stimulation by transient temperature fields. The method exploits singularities in materials and int