Zobrazeno 1 - 10
of 23
pro vyhledávání: '"Henri Seppänen"'
Publikováno v:
Journal of Materials Science. 57:20957-20973
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::08ba5adc63906e41cfd1a327b48fff36
https://doi.org/10.1007/s10853-022-07926-x
https://doi.org/10.1007/s10853-022-07926-x
Publikováno v:
International Symposium on Microelectronics. 2021:000256-000259
K&S developed and tested the Advanced Process Diagnostics (APD) algorithm to classify bonding outliers in ultrasonic wire bond production. APD is a software feature, part of Kulicke & Soffa wedge bonders to measure and analyze process signals and det
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::abe2678024e727f3da54f22340cbf42b
https://doi.org/10.4071/1085-8024-2021.1.000256
https://doi.org/10.4071/1085-8024-2021.1.000256
Autor:
Henri Seppänen
Publikováno v:
International Symposium on Microelectronics. 2020:000160-000164
Plastic frame power modules with press-fitted or molded pins create challenging bonding conditions. Pin stability variations, from relatively stable to unstable within a single power module, makes it difficult to find process parameters that fit to a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf6310fd4791b20412f5e1eaa91c5497
https://doi.org/10.4071/2380-4505-2020.1.000160
https://doi.org/10.4071/2380-4505-2020.1.000160
Autor:
Henri Seppänen
Publikováno v:
International Symposium on Microelectronics. 2016:000398-000401
In power electronics modules, ultrasonic wire bonding is a common method to make electronic connections between the connector pins and the IGBTs. In these modules the connector pins are often residing on top of the plastic frame. Due to the pins bein
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9f7d37606c60f3346e50eeb1696c391a
https://doi.org/10.4071/isom-2016-tha15
https://doi.org/10.4071/isom-2016-tha15
Autor:
Petri Toivanen, Antti Nuottajärvi, Timo Rauhala, J. Kauppinen, Mihkel Pajusalu, Jaanus Kalde, Olli Tarvainen, Henri Seppänen, Matis Averin, Taneli Kalvas, Pekka Janhunen, S.K. Kiprich, Kaspars Laizans, Viljo Allik, Henri Kuuste, Hannu Koivisto, Edward Hæggström, Erik Ilbis, Jukka Ukkonen, Jouni Envall
Publikováno v:
Proceedings of the Estonian Academy of Sciences. 63(2):210-221
The scientific mission of ESTCube-1, launched in May 2013, is to measure the electric solar wind sail (E-sail) force in orbit. The experiment is planned to push forward the development of the E-sail, a propulsion method recently invented at the Finni
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::72aebe632dbfba8e2a48101023e9d381
http://juuli.fi/Record/0028748214
http://juuli.fi/Record/0028748214
Publikováno v:
Computational Materials Science. 170:109149
With the use of molecular dynamics simulations, the contact between two substrates made of the same material is investigated for three different fcc metals: Al, Cu, and Ag. For this purpose, two misoriented substrates containing (1 1 1) planes parall
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a0463a9b4a392b19b9cc5d801b262da
https://doi.org/10.1016/j.commatsci.2019.109149
https://doi.org/10.1016/j.commatsci.2019.109149
Publikováno v:
Microelectronic Engineering. 104:114-119
We prove that we can, using contact resistance as a tool, determine the instant when the bonding process starts, i.e. microwelds start to form during ultrasonic bonding. This knowledge permits us to reduce the uncertainty in the estimated bonded area
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::51e5954605a342f766f0483d802429ae
https://doi.org/10.1016/j.mee.2012.12.003
https://doi.org/10.1016/j.mee.2012.12.003
Autor:
Aino Tietäväinen, Risto Kurppa, Edward Hæggström, Antti Meriläinen, Timo Rauhala, Henri Seppänen
Publikováno v:
Microelectronics Reliability. 54:1452-1454
We employ a real-time nondestructive contact resistance method to rapidly predict the end state of ultrasonic wire bonds. We classified 64 bonds as either successful (bond attached) or failed (bond unattached) with a support vector machine method. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d04bcf50808f75ef7440d10f81bfe1f9
https://doi.org/10.1016/j.microrel.2014.02.024
https://doi.org/10.1016/j.microrel.2014.02.024
Bonding quality monitoring applying statistical modeling of Scanning White Light Interferometry data
Publikováno v:
Microelectronic Engineering. 84:2757-2768
Scanning White Light Interferometry (SWLI) is an optical and hence non-destructive solution to precisely measure surface profiles, while bonding profiles yield information about the bond quality as determined by the pull force required to break the m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::50c35e26784cbe0d0e72775ced24e5dc
https://doi.org/10.1016/j.mee.2007.06.002
https://doi.org/10.1016/j.mee.2007.06.002
Autor:
Henri Seppänen, Heimo Saarikko, Ivan Kassamakov, Pasi Vihinen, Markku Oinonen, Zoran Radivojevic
Publikováno v:
Microelectronics Reliability. 46:116-123
An advanced method for the quality assessment of microelectronic assemblies has been developed by combining IR thermography and several techniques for stimulation by transient temperature fields. The method exploits singularities in materials and int
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d53bb849c887ec4937329d47409921a2
https://doi.org/10.1016/j.microrel.2005.01.013
https://doi.org/10.1016/j.microrel.2005.01.013