Zobrazeno 1 - 10
of 32
pro vyhledávání: '"Hengpeng Wu"'
Autor:
Masato Suzuki, YoungJin Kim, YoungJun Her, Hengpeng Wu, Kun Si, Mark Maturi, Philipp-Hans . Fackler, Mansour Moinpour, Ralph Dammel, Yi Cao
Publikováno v:
Advances in Patterning Materials and Processes XL.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::890cfc8d490d73602991d20702d1e2ec
https://doi.org/10.1117/12.2659716
https://doi.org/10.1117/12.2659716
Autor:
Zongbao, Zhou, Jiangwei, Xiao, Sheng, Huang, Hengpeng, Wu, Shuwen, Guan, Tingting, Wu, Shan, Yu, Shuai, Huang, Botao, Gao
Publikováno v:
International Journal of Biological Macromolecules. 230:123158
Local hemostats still face obstacles to efficiently achieving hemostasis and promoting wound healing. Herein, a series of multifunctional well-degradable hemostatic sponges based-on carboxymethylated yeast β-glucan (CMYG) were fabricated by lyophili
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::8802438c49f3c01d42e2c648fff3d24a
https://doi.org/10.1016/j.ijbiomac.2023.123158
https://doi.org/10.1016/j.ijbiomac.2023.123158
Autor:
Jianhui Shan, Kazunori Kurosawa, Hengpeng Wu, Shinji Miyazaki, Young Jun Her, Jihoon Kim, Jian Yin, Yi Cao, Guanyang Lin, Jingxiu Wan
Publikováno v:
Journal of Photopolymer Science and Technology. 26:573-579
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1a8ef6a39a058d808b68e8143b0df617
https://doi.org/10.2494/photopolymer.26.573
https://doi.org/10.2494/photopolymer.26.573
Autor:
Jae-woo Nam, Jongsu Lee, Jian Yin, Yi Cao, Boon Teik Chan, Arjun Singh, Hengpeng Wu, Roel Gronheid
Publikováno v:
SPIE Proceedings.
Directed self-assembly (DSA) of block copolymers (BCP) has attracted significant interest as a patterning technique over the past few years. We have previously reported the development of a new process flow, the CHIPS flow (Chemo-epitaxy Induced by P
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27060fc54d80b8e776700e5f6f03bbfa
https://doi.org/10.1117/12.2219261
https://doi.org/10.1117/12.2219261
Autor:
Kathleen Nafus, Roel Gronheid, Christopher J. Thode, Guanyang Lin, Hengpeng Wu, Mark Somervell, Paul F. Nealey, Paulina Rincon Delgadillo, Yi Cao
Publikováno v:
Journal of Photopolymer Science and Technology. 25:77-81
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84a6bdb4a11a02154ad9a7eb72f06c8a
https://doi.org/10.2494/photopolymer.25.77
https://doi.org/10.2494/photopolymer.25.77
Autor:
Shinji Miyazaki, David J. Abdallah, Douglas Mckenzie, Ruzhi Zhang, Woo-Kyu Kim, Lyudmila Pylneva, Ralph R. Dammel, Dalil Rahman, Hengpeng Wu, P-H. Lu, M. Nisser, Alberto D. Dioses, Allen Timko, Frank Houlihan
Publikováno v:
Journal of Photopolymer Science and Technology. 20:697-705
New challenges face ArF bottom antireflection coatings (BARCs) with the implementation of high NA lithography and the concurrent increase use of spin-on hard masks. To achieve superior reflectivity control with high NA at least two semi-transparent A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8687ed0efc6edcff1186cffb8d4b72e2
https://doi.org/10.2494/photopolymer.20.697
https://doi.org/10.2494/photopolymer.20.697
Autor:
Francis M. Houlihan, Hengpeng Wu, Ping-Hung Lu, Joseph E. Oberlander, Alexandra Krawicz, Medhat A. Toukhy, Andrew Romano, Salem K. Mullen, Alberto D. Dioses, Mark Neisser
Publikováno v:
Journal of Photopolymer Science and Technology. 20:359-364
Our approach towards a second generation radiation sensitive developable bottom antireflective coating (DBARC's) for 193 nm and its use with different implant resist resin types will be discussed. Ion beam implant resistance (As implantation 15 KeV a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5680ab37a322727d5dcbd5cb89a9343a
https://doi.org/10.2494/photopolymer.20.359
https://doi.org/10.2494/photopolymer.20.359
Autor:
Jianhui Shan, Tomohiko Tsutsumi, YoungJun Her, Yi Cao, Hengpeng Wu, Jian Yin, Jihoon Kim, Claire Petermann, Guanyang Lin
Publikováno v:
Alternative Lithographic Technologies VII.
Significant progresses on 300 mm wafer level DSA (Directed Self-Assembly) performance stability and pattern quality were demonstrated in recent years. DSA technology is now widely regarded as a leading complementary patterning technique for future no
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::876348435a07c915970330072bee7332
https://doi.org/10.1117/12.2086160
https://doi.org/10.1117/12.2086160
Publikováno v:
Advanced Materials. 13:703-714
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88f63a04281c95e62f9ffa40b3cff250
https://doi.org/10.1002/1521-4095(200105)13:10<703::aid-adma703>3.0.co
https://doi.org/10.1002/1521-4095(200105)13:10<703::aid-adma703>3.0.co
Autor:
Kathleen Nafus, Paulina Rincon Delgadillo, Yi Cao, Hengpeng Wu, Mark Somervell, Roel Gronheid, Paul F. Nealey, Christopher J. Thode
Publikováno v:
Alternative Lithographic Technologies IV.
Directed Self-Assembly (DSA) of block copolymers is considered to be a potential lithographic solution to achieve higher feature densities than can be obtained by current lithographic techniques. However, it is still not well-established how amenable
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7de8cc4c72605cf7bb8b12865599a88b
https://doi.org/10.1117/12.916410
https://doi.org/10.1117/12.916410