Zobrazeno 1 - 5
of 5
pro vyhledávání: '"Henggang Yin"'
Autor:
Kai Li, Hong Yang, Mengting Zou, Bingyuan Yang, Huibin Xu, Huaxia Zhao, Henggang Yin, Yanlong Ma
Publikováno v:
Materials Research Express, Vol 9, Iss 11, p 116518 (2022)
The microstructure and corrosion processes of a friction stir welded (FSW) 7075-T6 aluminum alloy joint, before and after anodizing surface treatment, have been characterized by advanced techniques, and the feasibility of anodizing treatment as a cor
Externí odkaz:
https://doaj.org/article/fdf38d8e17774b50b45e7daf0829c231
Publikováno v:
Journal of Alloys and Compounds. 614:63-70
The effects of Cu and Zn additions on microstructures, thermal and mechanical properties of Sn–Bi-based solder alloy were investigated. Thermal analysis indicated that Cu addition decreased both melting point and paste region of Sn–Bi-based solde
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5375865ccb4da9d90c72ba1a844a54fc
https://doi.org/10.1016/j.jallcom.2014.06.015
https://doi.org/10.1016/j.jallcom.2014.06.015
Publikováno v:
Journal of Electronic Materials. 44:532-541
Effects of minor Cu, Zn additions on the wettability, microstructures, and shear properties of Sn-Bi-based lead-free solder joints were investigated. The results show that a Cu addition promotes the wetting ratio of solder alloy, while Zn creates the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0c3aad9f30c79ef5416ab3b6e1fae4e5
https://doi.org/10.1007/s11664-014-3460-3
https://doi.org/10.1007/s11664-014-3460-3
Publikováno v:
Journal of Materials Science: Materials in Electronics. 24:203-210
ZrO2 nano-particles reinforced Sn8Zn1Bi–xZrO2 (x = 0.25, 0.5 and 1) composite solder balls were prepared by a mechanical mixing method and then they were reflowed on Cu substrates. The influences of ZrO2 nano-particles on the microstructures and mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e6bdc61c9d2224ae45c3309436a942a
https://doi.org/10.1007/s10854-012-0711-z
https://doi.org/10.1007/s10854-012-0711-z
Publikováno v:
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
In this paper, the wettability of Sn-0.7Cu solder alloy on different substrates (Cu, Cu/Ni, Cu/Ni/Au and Cu/Ni/Ag) at different temperatures (530 K, 560 K and 590 K respectively) were investigated by microstructural observations, phase analysis and w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ea35b91226566f429ac261825e8e0894
https://doi.org/10.1109/icept-hdp.2012.6474618
https://doi.org/10.1109/icept-hdp.2012.6474618