Zobrazeno 1 - 9
of 9
pro vyhledávání: '"Hengfu Li"'
Publikováno v:
Materials, Vol 14, Iss 2, p 258 (2021)
The high strain rate deformation behavior and microstructure evolution of in situ TiB2 particle reinforced Al-Zn-Mg-Cu composite were investigated by means of Taylor impact. The dynamic tests were performed at three different impact velocities. Under
Externí odkaz:
https://doaj.org/article/d019cb78b53f4cdb9468e2cb43adbb7a
Publikováno v:
Materials
Volume 14
Issue 2
Materials, Vol 14, Iss 258, p 258 (2021)
Volume 14
Issue 2
Materials, Vol 14, Iss 258, p 258 (2021)
The high strain rate deformation behavior and microstructure evolution of in situ TiB2 particle reinforced Al-Zn-Mg-Cu composite were investigated by means of Taylor impact. The dynamic tests were performed at three different impact velocities. Under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::221ba3add2636f0d54ad92289a012e62
Autor:
Hengfu, Li, Zhenyu, Yu, Peng, Rong, Yi, Wu, Xulong, Hui, Fengguo, Zhang, Zhe, Chen, Haowei, Wang
Publikováno v:
Materials
The high strain rate deformation behavior and microstructure evolution of in situ TiB2 particle reinforced Al-Zn-Mg-Cu composite were investigated by means of Taylor impact. The dynamic tests were performed at three different impact velocities. Under
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=pmid________::f0033a3db164fbf60241d43604abfcc9
https://pubmed.ncbi.nlm.nih.gov/33430284
https://pubmed.ncbi.nlm.nih.gov/33430284
Autor:
Dong Zhang, Tingping Hou, Xueling Quan, Jie Zhou, Chaochao Yin, Hengfu Lin, Zhihong Lu, Kaiming Wu
Publikováno v:
Journal of Materials Research and Technology, Vol 25, Iss , Pp 210-221 (2023)
The mechanism of austenite formation in medium Mn steel tempered at 700 °C for 3 h without and with a 12 T magnetic field was investigated. The application of magnetic field results in lattice distortion of the martensite matrix, implying the presen
Externí odkaz:
https://doaj.org/article/2f03227d648a46ef9e8cabe7804c5638
Publikováno v:
2016 17th International Conference on Electronic Packaging Technology (ICEPT).
Three-dimensional (3D) integration is considered as a good alternative solution to overcome the limitations of silicon scaling. Through Silicon Via (TSV) and wafer bonding are two key elements for 3D integration. This paper focuses on the realization
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::88845623ae9a509f6f72d14e6dd67050
https://doi.org/10.1109/icept.2016.7583291
https://doi.org/10.1109/icept.2016.7583291
Publikováno v:
2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC).
2.5D/3D integration has been attracting both academic and industry interests for extending the Moore's Low in recent years and several products using such technology have been emerged. This paper introduces the development progress of key process mod
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cdd385d9299f54108f1a2ffac7e062a5
https://doi.org/10.1109/edssc.2015.7285095
https://doi.org/10.1109/edssc.2015.7285095
Publikováno v:
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).
The dielectric insulation layer is critical to the TSV package reliability and the process of forming sidewall insulation of through silicon via (TSV) was a challenging bottleneck in 3D integration. In this paper, dielectric insulation layers in TSV
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2b2b06d796a7c29091ae195c6085f090
https://doi.org/10.1109/eptc.2014.7028393
https://doi.org/10.1109/eptc.2014.7028393
Autor:
Dong Zhang, Tingping Hou, Xuan Liang, Peng Zheng, Weidi Luo, Hengfu Lin, Xiangheng Xiao, Kaiming Wu
Publikováno v:
Materials & Design, Vol 221, Iss , Pp 111023- (2022)
A combination of first-principles calculations, Weiss molecular field theory and density functional perturbation theory is combined to systematically evaluate the magnetic-field-induced thermodynamic properties of the alloy carbide M7C3 in steel. Spe
Externí odkaz:
https://doaj.org/article/fffe9e7ac5fa4cd0af7423fa0234f27d
Publikováno v:
Metals, Vol 9, Iss 8, p 909 (2019)
Alloy carbide M23C6 plays a significant role in the creep strength of reduced activation steels. Experiments have proven that a magnetic field accelerates the precipitation of M23C6 at intermediate temperature. A scheme that combines first-principle
Externí odkaz:
https://doaj.org/article/7348da10dbb647c6a8706aa99e135aee