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pro vyhledávání: '"Heng-chuan Shu"'
Autor:
Heng-chuan Shu, 許�睇�
96
The analysis result reveals, the liquid bumper of magnetic rheology, when 24km/hr, 32km/hr 64km/hr and 80km/hr collide, install additional magnetic rheology liquid buffer system with real train collide, test, compare, simulation result reveal
The analysis result reveals, the liquid bumper of magnetic rheology, when 24km/hr, 32km/hr 64km/hr and 80km/hr collide, install additional magnetic rheology liquid buffer system with real train collide, test, compare, simulation result reveal
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/25191544357598822542
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
Transistor process technology continues to develop, the die size is shrinking approximately 20% to 35% with the process scaling. It is beneficial as smaller die can fit into several of small electronic devices for instance microprocessor watch and sm
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8675f57f1f18b0ad6a198b61ba71f579
https://doi.org/10.1109/icep-iaac.2015.7111108
https://doi.org/10.1109/icep-iaac.2015.7111108
Publikováno v:
2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).
As microprocessor market is expanding and moving toward tablet and smart phone segment, the conventional power integrity design practice which is placing package and board capacitor to stabilize voltage supply is no longer a favorable solution. Due t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0fc7b8f96d2c284af904e8aae6db7e9b
https://doi.org/10.1109/icep-iaac.2015.7111109
https://doi.org/10.1109/icep-iaac.2015.7111109
Autor:
Li Chuang Quek, Heng Chuan Shu
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP).
The IC (integrated circuit) packaging technology has evolved and transitioned from wirebond to flipchip, multi-chip package (MCP) to 3D stacking. PoP (Package on Package) enables the vertical integration of memory on the conventional package which he
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::20950af5c053b3c62c449458f2a42cf7
https://doi.org/10.1109/icep.2014.6826741
https://doi.org/10.1109/icep.2014.6826741
Publikováno v:
Fifth Asia Symposium on Quality Electronic Design (ASQED 2013).
The conventional power delivery analysis applying Icc(t) approach has the propensity to yield pessimistic outcome that leads to power delivery network (PDN) over-design. In addition, the noise profile captured using Icc(t) approach has high prospect
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63ab11b2325e8ab8bfc17547153f8278
https://doi.org/10.1109/asqed.2013.6643577
https://doi.org/10.1109/asqed.2013.6643577
Autor:
Heng Chuan Shu, Li Chuang Quek
Publikováno v:
2014 International Conference on Electronics Packaging (ICEP); 2014, p559-562, 4p