Zobrazeno 1 - 10
of 57
pro vyhledávání: '"Heng-Chieh Chien"'
Autor:
Jui-Cheng Yu, Heng-Chieh Chien, Chao-Yang Chiang, En-Chia Liu, Yu-Hsiang Chang, Hung-Hsien Huang, Tang-Yuan Chen, Chin-Li Kao, Chien-Neng Liao
Publikováno v:
Applied Thermal Engineering. 228:120495
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b59d6328c91ee234df3eedee871fd94
https://doi.org/10.1016/j.applthermaleng.2023.120495
https://doi.org/10.1016/j.applthermaleng.2023.120495
Publikováno v:
2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
This paper describes a non-simulation method to determine the thermal performance of a package structure. This method uses a methodology, we called layer-by-layer solving method, which can quickly solve the thermal resistance of the entire package ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b28728e1b747f662d1735380f40b0d6c
https://doi.org/10.1109/vlsi-tsa48913.2020.9203733
https://doi.org/10.1109/vlsi-tsa48913.2020.9203733
Publikováno v:
Physics of Fluids. 33:102102
We investigate how topology impacts capillary action with the hope of aiding future thermal engineering decisions. Heat pipes and their two-dimensional variant, vapor chambers are essential components in electronics cooling. With thin-film evaporatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7418a3f40e801b2bf0877a409a971006
https://doi.org/10.1063/5.0064974
https://doi.org/10.1063/5.0064974
Autor:
Ying-Chung Chen, Zheng-You Zhan, Chi-Pi Lin, Jui-Yang Chang, Chih-Yu Wen, Heng-Chieh Chien, Jyun-Min Lin
Publikováno v:
Microelectronic Engineering. 148:51-54
The structures and thermoelectric properties of n-type silver-doped Bi2Te3 thin films on SiO2/Si substrates using thermal co-evaporation method were reported. Annealing effects on the thermoelectric properties of thin films were also investigated in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9a978fc94c421996f009d5c5f37aa7ce
https://doi.org/10.1016/j.mee.2015.08.008
https://doi.org/10.1016/j.mee.2015.08.008
Autor:
Yu-Mei Cheng, Ren-Shing Cheng, Li-Ling Liao, Jui-Feng Hung, Yu-Lin Chao, Ra-Min Tain, Ming-Ji Dai, Yu-Wei Huang, Heng-Chieh Chien, Chun-Hsien Chien, Wei-Chung Lo, Chau-Jie Zhan, Ching-Kuan Lee, Ming-Jer Kao, Sheng-Tsai Wu, John H. Lau
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:1407-1419
In this investigation, a system-in-package (SiP) that consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top and bottom sides (a real 3-D IC integration) is studied. Emphasis is placed on the fabrication of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4899c0a43489c421c7a9a17198bae8a
https://doi.org/10.1109/tcpmt.2014.2339832
https://doi.org/10.1109/tcpmt.2014.2339832
Publikováno v:
International Journal of Thermal Sciences. 145:105979
A general solution, based on the method of separation of variables, for the temperature distribution of an orthotropic rectangular substrate heated by heat sources on one side and cooled with a non-uniform heat transfer coefficient on the opposite si
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cf416ca63507c7d11ef14ca17d01033c
https://doi.org/10.1016/j.ijthermalsci.2019.105979
https://doi.org/10.1016/j.ijthermalsci.2019.105979
Autor:
Heng-Chieh Chien1, Lau, John H.1, Yu-Lin Chao1, Ra-Min Tain1, Ming-Ji Dai1, Sheng-Tsai Wu1, Wei-Chung Lo1, Ming-Jer Kao1 Jack_Chien@itri.org.tw
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2012 2nd Quarter, Vol. 9 Issue 2, p97-103. 7p.
Autor:
Chii Rong Yang, Da-Jeng Yao, Chun Kai Liu, Heng Chieh Chien, Ra Min Tain, Ming Ji Dai, Li-Ling Liao
Publikováno v:
Applied Thermal Engineering. 51:75-83
Because of a lack of appropriate methods and the difficulties of sample preparation, few direct measurements of the thermal conductivity of thermoelectric materials in thin films have been reported. We prepared thermoelectric thin films of four types
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9abb19a1f12e14861366ba6b96a74c6e
https://doi.org/10.1016/j.applthermaleng.2012.09.004
https://doi.org/10.1016/j.applthermaleng.2012.09.004
Publikováno v:
International Symposium on Microelectronics. 2013:000389-000396
Thin-wafer handling is one of the key enabling technologies for 2.5D/3D IC integration. Usually, it temporary bonds the TSV (through-silicon via)/RDL (redistribution layer) wafer (e.g., passive and active interposers) to a supporting carrier wafer wi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a71415e4b3904b1ab84cd92cafd0df73
https://doi.org/10.4071/isom-2013-tp61
https://doi.org/10.4071/isom-2013-tp61
Autor:
Heng-Chieh Chien, Ra-Min Tain, Chun-Hsien Chien, Ming-Ji Dai, Wei-Chung Lo, Yung-Jean Rachel Lu
Publikováno v:
International Symposium on Microelectronics. 2013:000611-000617
In this study, we used simulation technique to analyze the thermal characteristics of solo TGV (through-glass via) structure and solo TSV (through-silicon via) structure. The analysis showed, no matter in in-plane direction or in cross-plane directio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3c826c70202b76fc158582cb0350ff27
https://doi.org/10.4071/isom-2013-wp11
https://doi.org/10.4071/isom-2013-wp11