Zobrazeno 1 - 10
of 30
pro vyhledávání: '"Heng Cheng-Lin"'
Publikováno v:
Scientific Reports
This study investigated the interaction effects of meteorological factors and air pollutants on the onset of acute coronary syndrome (ACS). Data of ACS patients were obtained from the Taiwan ACS Full Spectrum Registry and comprised 3164 patients with
Publikováno v:
Acta Physico-Chimica Sinica. 28:1520-1524
Akademický článek
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Publikováno v:
Composite Structures. 49:1-8
This paper addresses the use of finite element techniques and Taguchi method to optimize package design for plastic quad flat packages (PQFP) with and without a heat slug assembled. Warpage in both types of PQFPs during the curing process of temperat
Autor:
Heng-Cheng Lin, 林恒丞
97
The use of non-destructive testing (NDT) techniques for the evaluation of in-service pavement conditions has been widely accepted in the past few decades. Among the available NDT devices, the Falling Weight Deflectometer (FWD) is one of the m
The use of non-destructive testing (NDT) techniques for the evaluation of in-service pavement conditions has been widely accepted in the past few decades. Among the available NDT devices, the Falling Weight Deflectometer (FWD) is one of the m
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/23156209499559143854
Autor:
Heng-Cheng Lin, 林恆正
95
This thesis is about the design of pixel and driving circuits for active matrix organic light emitting diode (AMOLED) that is produced by using low temperature polysilicon (LTPS) process. It issues a new model of pixel circuit and tries to pr
This thesis is about the design of pixel and driving circuits for active matrix organic light emitting diode (AMOLED) that is produced by using low temperature polysilicon (LTPS) process. It issues a new model of pixel circuit and tries to pr
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/77160325569976162765
Autor:
Heng-cheng Lin, 林恒正
95
Multi-chip module (MCM) is a single package, which encapsulates more than one die. The purpose is to reduce the dimension, improve performance, lower power consumption and save the cost. A MCM package consists of various components, when it i
Multi-chip module (MCM) is a single package, which encapsulates more than one die. The purpose is to reduce the dimension, improve performance, lower power consumption and save the cost. A MCM package consists of various components, when it i
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/02825932414845460806
Publikováno v:
ASME 2007 InterPACK Conference, Volume 1.
This paper presents a study of the effects of selected geometry features on the fatigue life of the Sn3.5Ag lead-free solder ball on a multi-chip module (MCM) package. The features considered are both the upper and lower solder pad radii, the thickne
Akademický článek
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Autor:
Heng-Cheng Lin
Publikováno v:
1981 Antennas and Propagation Society International Symposium.