Zobrazeno 1 - 10
of 68
pro vyhledávání: '"Hendrikus Tilmans"'
Autor:
Simone Severi, W.J. Westervelde, Md. Mahmud-Ul-Hasan, Xavier Rottenberg, B. Figeys, Hendrikus Tilmans, Roelof Jansen, Véronique Rochus, S. Seema, Kristof Lodewijks
One of the possible applications for MEMS-above CMOS or optical MEMS is for inertial/integrated measurement units (IMUs). These have gained the status of mainstream commodities for consumer electronics in the past years and find use in guidance, navi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f107781758f509c2143b1f3d5b38a09
https://doi.org/10.1016/b978-0-12-817786-0.00050-5
https://doi.org/10.1016/b978-0-12-817786-0.00050-5
Publikováno v:
2016 IEEE SENSORS.
The paper describes the key challenges of CMOS integrated monolithic MEMS Accelerometer with SiGe MEMS technology combined with TSMC 0.18 μm CMOS technology. The developed SiGe MEMS technology shows ability to integrate above any standard foundry pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1328276af5b8f6a9e6e8ebbdb716e89f
https://doi.org/10.1109/icsens.2016.7808583
https://doi.org/10.1109/icsens.2016.7808583
Publikováno v:
Microwave and Optical Technology Letters. 54:1788-1792
In this article, we present a V-band low-phase-noise oscillator stabilized by a silicon integrated cavity resonator (SiCR). The SiCR is realized in a multi chip module-deposited thin-film technology platform. The high resistivity silicon substrate is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2cae1c7bcc28dca7a2c6edd31a9a6fc9
https://doi.org/10.1002/mop.26946
https://doi.org/10.1002/mop.26946
Autor:
L. Haspeslagh, Agnes Verbist, Ann Witvrouw, Simone Severi, Bert Du Bois, Lianggong Wen, Robert Puers, B. Wang, Shuji Tanaka, J. De Coster, Gert Claes, Hendrikus Tilmans, Guy Vereecke, Haris Osman, B. Guo, R Van Hoof, I. De Wolf, Stefaan Decoutere, Philippe Helin
Publikováno v:
Journal of Microelectromechanical Systems. 21:110-120
This paper presents an attractive poly-SiGe thin-film packaging and MEM (microelectromechanical) platform technology for the generic integration of various packaged MEM devices above standard CMOS. Hermetic packages with sizes up to 1 mm2 and differe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::11ae49dce6d5b816260eada47e109342
https://doi.org/10.1109/jmems.2011.2170823
https://doi.org/10.1109/jmems.2011.2170823
Publikováno v:
Microwave and Optical Technology Letters. 54:491-496
In this article, we investigate the tuning and miniaturization performance induced by a volume perturbation inserted in a cavity resonator. The volume perturbation is either a rectangular perturbation centrally located, called central postperturbatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7bd6159c025362623ea035d5c30ddfcb
https://doi.org/10.1002/mop.26578
https://doi.org/10.1002/mop.26578
Autor:
Hendrikus Tilmans, Xavier Rottenberg, Robert Mertens, P. Czarnecki, H. Philipsen, P. Ekkels, Robert Puers
Publikováno v:
Sensors and Actuators A: Physical. 166:256-263
This paper presents a simple and robust process for fabrication of functional electrostatic RF-MEMS switching devices with lifetimes easily exceeding 10 8 cycles by unipolar actuation at 100 Hz. The device implements a switchable air gap capacitor an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a74817ff00e4a15222d370df7e4a2bd1
https://doi.org/10.1016/j.sna.2009.11.025
https://doi.org/10.1016/j.sna.2009.11.025
Autor:
J. Lauria, Twan Bearda, M.C. de Nooijer, I. De Wolf, E.J. Lous, B. Schlatmann, R. Vanneer, J. De Coster, M.J. van Bommel, Hendrikus Tilmans, L. Haspeslagh, Ann Witvrouw, M. Hagting, Olalla Varela Pedreira, B. van Drieenhuizen, P.H.C. Magnee
Publikováno v:
Journal of Microelectromechanical Systems. 19:202-214
In this paper, we report on the design, fabrication, packaging, and testing of very reliable CMOS-integrated 10-cm2 11-megapixel SiGe-based micromirror arrays on top of planarized six-level metal 0.18-?m CMOS wafers. The array, which is to be used as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::42d5d7fbb9a5a48cbcf26db9f2373043
https://doi.org/10.1109/jmems.2009.2036271
https://doi.org/10.1109/jmems.2009.2036271
Autor:
Xavier Rottenberg, P. Muller, Philippe Soussan, L. Marchand, Hendrikus Tilmans, W. De Raedt, Robert Puers, P. Czarnecki, I. De Wolf, P. Nolmans, P. Ekkels
Publikováno v:
Sensors and Actuators A: Physical. 154:261-268
In this paper, we show that substrate charging is another possible failure mechanism limiting the lifetime of capacitive RF MEMS switches. Switches fabricated on different substrates can exhibit a different lifetime. Also the influence of environment
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ba1939519fe2dfa87294b559adfdd582
https://doi.org/10.1016/j.sna.2008.07.003
https://doi.org/10.1016/j.sna.2008.07.003
Publikováno v:
Sensors and Actuators A: Physical. 154:304-315
In this paper, a novel technique to characterize MEMS is described. The technique is based on electric admittance measurements of electrostatically actuated MEMS. It is capable of determining a number of characteristic parameters such as the unbiased
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::86ebf0464ff9c7fc36d5f3b706f11b2a
https://doi.org/10.1016/j.sna.2008.06.032
https://doi.org/10.1016/j.sna.2008.06.032
Autor:
Hendrikus Tilmans, Xavier Rottenberg, P. Nolmans, P. Czarnecki, P. Ekkels, I. De Wolf, W. De Raedt, Robert Puers, Robert Mertens, Steven Brebels, Bart Nauwelaers
Publikováno v:
Journal of Micromechanics and Microengineering. 17:S204-S210
This paper presents a novel electrostatic actuator using fringing fields as the actuation mechanism, i.e. an electrostatic fringing-field actuator or EFFA. The novel device is produced on an insulating substrate in a simple two-mask process involving
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d4b986e4a08bac9af41ddf137e23d831
https://doi.org/10.1088/0960-1317/17/7/s19
https://doi.org/10.1088/0960-1317/17/7/s19