Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Hemanth Kumar Cheemalamarri"'
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a73e95812db459135f2e5335b321692c
https://doi.org/10.1109/eptc56328.2022.10013182
https://doi.org/10.1109/eptc56328.2022.10013182
Publikováno v:
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8c05b1b6c693fd9dc3de3418f431c4e2
https://doi.org/10.1109/eptc56328.2022.10013232
https://doi.org/10.1109/eptc56328.2022.10013232
Autor:
Shiv Govind Singh, Hemanth Kumar Cheemalamarri, Satish Bonam, Siva Rama Krishna Vanjari, Dhiman Banik
Publikováno v:
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
Thermal management is the critical issue in all present conventional 2D electronic packages, and is more crucial in the case staked dies of advanced 3D IC technology, because of increased power density and complex chip designs. The traditional method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9af45da3b1e76ebc52460995f3aaafc1
https://doi.org/10.1109/eptc47984.2019.9026576
https://doi.org/10.1109/eptc47984.2019.9026576
Publikováno v:
Surface Topography: Metrology and Properties. 8:045008
Metal-Metal diffusion bonding was reassuring for micro electro mechanical system (MEMS) packaging and three dimensional (3D) integration. Despite copper and gold, aluminum (Al) is also proficient for wafer-level bonding due to its CMOS compatibility.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2e4bbea9b85002de5108358b9f6eaac7
https://doi.org/10.1088/2051-672x/abbb81
https://doi.org/10.1088/2051-672x/abbb81
Publikováno v:
Journal of Micromechanics and Microengineering. 30:105005
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d94787c2e0eb97cff50e6aa5b38f021
https://doi.org/10.1088/1361-6439/ab9f00
https://doi.org/10.1088/1361-6439/ab9f00
Autor:
Nirupam Paul, Shiv Govind Singh, Siva Rama Krishna Vanjari, Hemanth Kumar Cheemalamarri, Asisa Kumar Panigrahi, Satish Bonam
Publikováno v:
2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
There is a gradual increase in demand for flexible electronics due to the way it is going to empower the end user - to bent, roll/fold and arrange randomly in 3-D space, the devices without sacrificing the performance and reliability of devices, in a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::77b1c8bfefd91313c7b29c196a010cbc
https://doi.org/10.1109/ectc.2018.00260
https://doi.org/10.1109/ectc.2018.00260