Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Helme Castro"'
Publikováno v:
Journal of The Electrochemical Society. 161:A2121-A2127
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c838f28e7bc99467d7390a64cd01784f
https://doi.org/10.1149/2.0591414jes
https://doi.org/10.1149/2.0591414jes
Autor:
Kousik Ganesan, Rahul Manepalli, Marcel Wall, Andrew Wentzel, Helme Castro, Wencaho Li, Thomas Heaton
Publikováno v:
ECS Meeting Abstracts. :1250-1250
Low cost electroplating of copper to create Fine Line Space (FLS) features and Blind Micro Via’s (BMV) is a key technology element of high density substrates for integrated circuit packaging. In this work, we demonstrate a capable deposition method
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::afe59f44bfce065e645c8aa096fb316d
https://doi.org/10.1149/ma2019-02/28/1250
https://doi.org/10.1149/ma2019-02/28/1250
Publikováno v:
Journal of The Electrochemical Society; 2014, Vol. 161 Issue 14, pA2121-A2127, 7p