Zobrazeno 1 - 10
of 11
pro vyhledávání: '"Helge Wurst"'
Publikováno v:
2023 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::eae2a2bb57984d5131b5cb225d5fcd3f
https://doi.org/10.23919/icep58572.2023.10129656
https://doi.org/10.23919/icep58572.2023.10129656
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b7b20a7af7aa728516a700d98c117b25
https://doi.org/10.23919/icep55381.2022.9795398
https://doi.org/10.23919/icep55381.2022.9795398
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e772ce3863271801ac538c9db7a9bd11
https://doi.org/10.23919/icep55381.2022.9795363
https://doi.org/10.23919/icep55381.2022.9795363
Autor:
Marc Weber, Bao Ngoc An, Hideo Nakako, Matthias Mail, Helge Wurst, Benjamin Leyrer, Dai Ishikawa, Thomas Blank
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 13:E20-003
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e9bf5d0e7257d74459cc09d8b8eb629c
https://doi.org/10.5104/jiepeng.13.e20-003-1
https://doi.org/10.5104/jiepeng.13.e20-003-1
Autor:
Matthias Mail, Helge Wurst, Hideo Nakako, Dai Ishikawa, Thomas Blank, Marc Weber, Benjamin Leyrer, Bao Ngoc An
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
Die-attach properties of mechanical pressure-assisted sintered copper (pressure-sintered Cu) on some metallization layers in N2 atmosphere for high-power devices were investigated. The shear strength of pressure-sintered Cu on Ag plating increased as
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ebd711fb7480990e8707a644b987437
https://doi.org/10.23919/icep51988.2021.9451911
https://doi.org/10.23919/icep51988.2021.9451911
Autor:
Thomas Blank, Hongpeng Zhang, Felix Steiner, Dai Ishikawa, Udo Geckele, Ivan Peric, Helge Wurst, Benjamin Leyrer
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
The mechanical behavior of Al 2 O 3 -DCB and Si 3 N 4 -AMB power modules comprising copper sintered SiC-and Si-dice in liquid to liquid thermal shock cycles (LL-TSC) from −40°C to +200 °C is presented. SiC-MOSFET dice from two different vendors a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::051146c7b4f44bf56cff190cd4a34671
https://doi.org/10.23919/icep51988.2021.9451860
https://doi.org/10.23919/icep51988.2021.9451860
Autor:
Thomas Blank, Dai Ishikawa, Helge Wurst, Bao Ngoc An, Benjamin Leyrer, Marc Weber, Volker Dudek, Matthias Luh
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
This paper describes the properties of GaAs PIN power diodes and demonstrates their utilization in a 650V 10kW LLC converter for fast charging of electric vehicles. The module comprises two SiC MOSFET half-bridges equipped with Rohm S4101 MOSFETs and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::07936163b85dc9315e1d611d17809bf4
https://doi.org/10.23919/icep.2019.8733484
https://doi.org/10.23919/icep.2019.8733484
Autor:
Hideo Nakako, Matthias Mail, Bao Ngoc An, Dai Ishikawa, Suguru Ueda, Helge Wurst, Thomas Blank, Marc Weber, Kawana Yuki, Benjamin Leyrer
Publikováno v:
2019 International Conference on Electronics Packaging (ICEP).
this paper describes thermal stabilities (573 K for 8 h) of pressureless-sintered Copper (Cu) on four kinds of top metallization layers (Ni, Cu, Ag, and Au) by experiments. Evolutions of sintering process of Cu nanoparticles and diffusion coefficient
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f19fae3a81c36018deb8e3ad17ac69ba
https://doi.org/10.23919/icep.2019.8733521
https://doi.org/10.23919/icep.2019.8733521
Autor:
Suguru Ueda, Matthias Mail, Marc Weber, Bao Ngoc An, Helge Wurst, Kawana Yuki, Dai Ishikawa, Thomas Blank, Benjamin Leyrer, Hideo Nakako
Publikováno v:
Transactions of The Japan Institute of Electronics Packaging. 13:E19-017
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebf6820b38ab13ff4bd6adbc333a4323
https://doi.org/10.5104/jiepeng.13.e19-017-1
https://doi.org/10.5104/jiepeng.13.e19-017-1
Autor:
Bao Ngoc An, Kawana Yuki, Helge Wurst, Suguru Ueda, Sugama Chie, Negishi Motohiro, Benjamin Leyrer, Yoshinori Ejiri, Thomas Blank, Dai Ishikawa, Hideo Nakako, Marc Weber
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
this paper describes the sintering properties and bonding properties of copper (Cu) die-bonding sinter paste for power devices operating at high temperatures. The Cu paste can be sintered pressure less in 100% H2 or under pressure in 100% N2 atmosphe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3f10e7d3404b806331e10ca864648dd2
https://doi.org/10.1109/estc.2018.8546455
https://doi.org/10.1109/estc.2018.8546455