Výsledky vyhledávání - "Helene Jacquinot"

Influence of substrate resistivity on porous silicon small-signal RF properties

Autor: Emmanuel Rolland, Helene Jacquinot, Thomas Lorne, F. Gaillard, Florence Servant, Geoffroy Godet, Jose Lugo-Alvarez, T. Taris, Emmanuel Augendre

Publikováno v: IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices, 2020, 67 (11), pp.4654-4657. ⟨10.1109/TED.2020.3023063⟩

International audience; This article provides guidelines to design porous silicon (PS) layers regarding optimization of small signal properties in passive structures for radio frequency (RF): insertion loss and crosstalk. Results are based on high-fr

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::46bc189812d908dd7f6f18058bb1964a
https://cea.hal.science/cea-03676642

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RF Characterization, Analysis and Miniaturization Impact of RDL Interconnects

Autor: Thierry Lacrevaz, Jean-Charles Barbe, Remi Velard, Alexis Farcy, Lucile Cheramy, Kevin Morot, Bernard Flechet, Roselyne Segaud, Helene Jacquinot, Lucile Arnaud

Publikováno v: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), May 2018, San Diego, United States. pp.2000-2006, ⟨10.1109/ECTC.2018.00300⟩

This work aims at providing a RLCG modeling and performance optimization of Redistribution Layer (RDL) in a non-HR substrate up to 67 GHz. Similarly to TSVs, RDL modeling can not be assessed by standard parasitic extraction CAD tools. Therefore, we p

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2e4971ab4228f2193472a951f2cd5b07
https://hal.science/hal-02015694

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RF Characterization and Modeling of 10 µm Fine-Pitch Cu-Pillar on a High Density Silicon Interposer

Autor: J. C. Barbe, Arnaud Garnier, Lucile Arnaud, S. Cheramy, Franck Bana, Helene Jacquinot

Publikováno v: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).

This work aims at providing a RLCG modeling ofthe 10 µm fine-pitch microbump type interconnects in the 100 MHz-40 GHz frequency band based on characterization approach. RF measurements are performed on two-port test structures within a short-loop wi

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::af1876eafd5aeeaf7d305cd07a9aea57
https://doi.org/10.1109/ectc.2017.26

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Wide-band simulations of differential 3D interconnect propagation performances in a photonic interposer

Autor: Helene Jacquinot, Alexis Farcy, Kevin Morot, Bernard Flechet, Cedric Bermond, Thierry Lacrevaz

Publikováno v: 2016 6th Electronic System-Integration Technology Conference (ESTC)
2016 6th Electronic System-Integration Technology Conference (ESTC), Sep 2016, Grenoble, France. pp.1-6, ⟨10.1109/ESTC.2016.7764483⟩

The continuous requirement of higher communication bandwidths in data centers or high performance computers drives the convergence between ASICs and optical I/Os. Combining 3D integration and Si-photonic technologies on a photonic interposer platform

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ed032b33c2ca93311e03894b77366fbe
https://hal.archives-ouvertes.fr/hal-02003969

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Characterization, modeling and optimization of 3D embedded trench decoupling capacitors in Si-RF interposer

Autor: Helene Jacquinot, David Denis

Publikováno v: 2013 IEEE 63rd Electronic Components and Technology Conference.

Integrated trench high density MIS (Metal Insulator Semiconductor) capacitors in Si-interposer are of great interest as they provide decoupling in a smart way using the third dimension of the silicon substrate. However, the use of various highly inte

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8c698cb9614dd321aa08a30b5c336483
https://doi.org/10.1109/ectc.2013.6575752

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A 1 nJ/b 3.2-to-4.7 GHz UWB 50 Mpulses/s double quadrature receiver for communication and localization

Autor: Helene Jacquinot, Pierre Vincent, Dominique Morche, Stephane Paquelet, Sylvain Bourdel, Francois Dehmas, O. Fourquin, Alexis Bisiaux, Jean Gaubert, Gilles Masson

Publikováno v: ESSCIRC

This paper describes the integration in a 0.13 µm CMOS of an Ultra Wide Band (UWB) receiver for communication and localization. It operates in the whole 3.2-to-4.7 GHz band of the IEEE.802.15.4a regulation mask. The proposed double quadrature cohere

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::4f9299efc8d3094b0a42a3978e0e95e3
https://doi.org/10.1109/esscirc.2010.5619753

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5 GHz Monolithic VCO with prescaler using BiCMOS SiGe technology

Autor: Helene Jacquinot, Jacques Majos, Patrice Senn

Publikováno v: 2000 30th European Microwave Conference.

Bipolar VCO and prescaler for 5GHz low cost wireless applications are presented. These circuits are implemented in a 0.35?m BiCMOS SiGe process (FT=45GHz). Phase noise value for a 4.82GHz bipolar VCO is ?12ldBc/Hz at 1MHz frequency offset. Based on C

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::fad2f6f50011fa9c2063e08d09b22731
https://doi.org/10.1109/euma.2000.338887

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