Zobrazeno 1 - 10
of 27
pro vyhledávání: '"Heinrich, Friedhelm"'
Autor:
Kajjout, Mohammed, Lemmouchi, Yahia, Jama, Charafeddine, Rolando, Christian, Villasmunta, Francesco, Heinrich, Friedhelm, Mazzah, Ahmed
Publikováno v:
In Reactive and Functional Polymers January 2019 134:40-48
Autor:
Bauer, Joachim, Fursenko, Oksana, Heinrich, Friedhelm, Gutke, Marko, Kornejew, Eckhart, Brödel, Oliver, Dietzel, Birgit, Kaltenbach, Alexander, Burkhardt, Martin, Edling, Matthias, Steglich, Patrick, Herzog, Michael, Schrader, Sigurd
Publikováno v:
Optical Materials Express, 12, 1, S. 204-224
Knowledge of optical constants, i.e. refractive index n and extinction coefficient k, and light scattering properties of optical polymers are required to optimize micro-optics for light-emitting diodes in terms of efficiency, color properties and lig
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1713::b6a8dd90687375ec84725024abfc6b42
https://opus4.kobv.de/opus4-th-wildau/frontdoor/index/index/docId/1566
https://opus4.kobv.de/opus4-th-wildau/frontdoor/index/index/docId/1566
Autor:
Bauer, Joachim, Gutke, Marco, Heinrich, Friedhelm, Edling, Matthias, Stoycheva, Vesela, Kaltenbach, Alexander, Burkhardt, Martin, Gruenefeld, Martin, Gamp, Matthias, Gerhard, Christoph, Steglich, Patrick, Steffen, Sebastian, Herzog, Michael, Dreyer, Christian, Schrader, Sigurd
Publikováno v:
Optical Materials Express, 10, 9, S. 2085-2099
In this work we present a novel optical polymer system based on polyurethane elastomer components, which combines excellent UV transparency with high thermal stability, good hardness, high surface tension and long pot life. The material looks very pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::22d841e1bc40f739912e5ff258099311
https://opus4.kobv.de/opus4-th-wildau/frontdoor/index/index/docId/1347
https://opus4.kobv.de/opus4-th-wildau/frontdoor/index/index/docId/1347
Autor:
Bauer, Joachim, Fursenko, Oksana, Marschmeyer, Steffen, Heinrich, Friedhelm, Villasmunta, Francesco, Villringer, Claus, Zesch, Christoph, Schrader, Sigurd
Publikováno v:
Journal of Vacuum Science & Technology B, 37, 6, Article-Nr. 062205
Through Silicon Via (TSV) technology is a key in 3D integration of circuits by the creation of interconnects using vias, which go through the full silicon wafer. Typically, a highly-selective Bosch Si etch process is used. It is characterized by a hi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od______1713::0bcb06f6c2edd0dc243f9a03e439448a
https://opus4.kobv.de/opus4-th-wildau/files/1609/JVST_B37_062205.pdf
https://opus4.kobv.de/opus4-th-wildau/files/1609/JVST_B37_062205.pdf
Autor:
Heinrich, Friedhelm, Hoffmann, Peter
Publikováno v:
Journal of Applied Physics; 2/15/1992, Vol. 71 Issue 4, p1683, 7p, 3 Diagrams, 2 Graphs
Akademický článek
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Akademický článek
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Autor:
Messaoudi, Hamza, Kumar Das, Susanta, Lange, Janine, Heinrich, Friedhelm, Schrader, Sigurd, Frohme, Marcus, Grunwald, Rüdiger
Publikováno v:
Progress in Nonlinear Nano-optics; 2015, p207-219, 13p
Autor:
Vivien, Laurent, Pavesi, Lorenzo, Pelli, Stefano, Steglich, Patrick, Mai, Christian, Stolarek, David, Lischke, Stefan, Kupijai, Sebastian, Villringer, Claus, Pulwer, Silvio, Heinrich, Friedhelm, Bauer, Joachim, Meister, Stefan, Knoll, Dieter, Casalboni, Mauro, Schrader, Sigurd
Publikováno v:
Proceedings of SPIE; April 2016, Vol. 9891 Issue: 1 p98910R-98910R-7, 890198p